吕宗兴-客户看载板

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1、LearningSubstrateTechnologyFromEnd-customer’sPerspectives呂宗興CharlieLu載板工程師基本訓練課程載板工程師應該具備的IC封裝知識掉球BGA/FlipChip金屬介面反應理論在封裝可靠性測試與載板間的關係IC封裝及SMT的應用從使用者角度學習IC載板製程技術Outline•Wire-bondingprocessv.s.Flipchipprocess•Frequentseendefectmodes–Relationshipbetweensubstra

2、teandpackage•VarioussubstrateMfg.technology–Tentingprocess–Etchingback–GPP(fullbodygold,doubleimage)–SelectivegoldWire-bondingv.s.FlipChip•Wire-bonding•Flipchip–Dieattach:–Dieattach:epoxyadhesivessolderreflow–Dieattachcuring–Fluxcleaning–(plasmaclean)–Subst

3、ratebaking–Wirebonding–plasmacleaning–(plasmaclean)–Underfilling–Molding–Underfillcuring–Post-moldcure–(ring/lidattachormolding)–Ballmount–BallmountSubstrateSubstrateFrequentSeenDefectModes–SubstrateRelated•Warpage–Dieattachfailed•Bondingpadcontamination–St

4、itchlift•Substrate/moldcapdelam•Cutracecrack/Viacrack•Solderballdrop-off(missingball)–Eitherassyrelatedorsubstraterelated•Solderballpadpeeling•Shortfailuredueto“foreignmaterial”SubstrateProcessOverviewBasic(Organic)SubstrateProcessFlow1.Pre1.Pre-1.Pre---Bak

5、ingBaking2.InnerLayerImagineTransferAOI3.Lamination4layer1.1.1.發料烘烤2.線路形成(((內層)))AOI自動光學檢測3.壓合2layer4.鑽孔5.鍍銅6.線路形成AOI自動光學檢測4.Drilling5.Copperplating6.ImagineTransferAOI10.E10.E-10.E---TestTest10.O/S電測9.裁切8.鍍Ni/Au7.綠漆9.Routing8.Ni/AuPlating7.S/MPrinting&Patt

6、erning包裝終檢出貨FVIPackageShipment1.烘烤(Pre-baking)•Condition:–150oC/2hrs•Purpose:–消除基板應力，，防止板彎，防止板彎﹑﹑板翹﹑板翹–安定尺寸，，減少板材漲縮，減少板材漲縮基材BT樹脂銅箔2.內層線路形成(ImagineTransfer)乾膜前處理壓乾膜曝光線路蝕刻(清潔銅面，增加乾(形成線路圖形)(形成線路)膜與銅面的密著性)刷磨(option)顯影水洗脫脂蝕刻水洗水洗酸洗(微蝕)酸洗水洗剝膜烘乾水洗壓乾膜乾膜曝光UVExposure光

7、罩MASK顯影蝕刻剝膜AOI自動光學檢測檢驗蝕刻後,線路是否有短路(short)、、斷路、斷路(open)、、線路缺、線路缺口(nick)、、線路突出、線路突出(protrusion)3.壓合(Lamination)(粗化銅面及改變銅結構增加棕化P.P與銅的附著性)(預先將內層板與P.P及外層預疊板銅箔以人工疊合成組)(將預疊板熱壓凝壓合固成多層板)鑽靶孔(作為鑽孔用之定位孔)裁板(將壓合後多餘邊料切除)4.鑽孔(Drilling)•Purpose:–作為上下層導通之通道–其他製程所需之對位孔、、定位孔、定位

8、孔、Tooling孔•Category:–Mechanicaldrill–LaserdrillMechanicalholeLaserviaMechanicalDrillLaserDrill•Category:–Co2Laser–UVLaser•Smallersizecomparedtomechanicaldrill.–150um~50um5.鍍銅(CuPlating)化學銅前處理去膠渣電鍍銅(PTH