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ID:44110887
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时间:2019-10-18
《SEMI G68-0996 TEST METHOD FOR JUNCTION-TO-CASE THERMAL》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、SEMIG68-0996N/A©SEMI1996TESTMETHODFORJUNCTION-TO-CASETHERMALRESISTANCEMEASUREMENTSINAIRENVIRONMENTFORSEMICONDUCTORPACKAGES1Purpose5TerminologyThepurposeofthistestistodeterminethethermalThefollowingdefinitionsandsymbolsshallapplytoresistanceofsemiconductorpackagesusingthermalthistest:testc
2、hips.Thistestmethoddealswithjunction-to-case5.1casetoptemperaturemeasuredinairenvironment,measurementsofthermalresistanceinairenviron-Tt—In°C,isthetemperatureatthespecifiedaccessi-ment.blereferencepointonthepackageinmeasuredinairenvironment.2ScopeNOTE1:TCdefinedinSEMIG43isdifferentfromTt.2
3、.1Theresultsofthistestmethodareusedtoobtainthejunctiontemperature.5.2junctiontemperature,Tj—In°C,isthetempera-tureofthesemiconductorjunctiononthemicrocircuit2.2Themeasurementresultsareusuallydifferentinwhichthemajorpartoftheheatisgenerated.fromtheresultsobtainedbytestinginthefluidbathenvi
4、ronmentdescribedinSEMIG30andSEMIG43.5.3powerdissipationPH—Inwatt,istheheatingpowerappliedtothedevicecausingajunction-toref-2.3ThistestmethodusesSIunits.erencepointtemperaturedifference.3Limitation5.4thermalresistancemeasuredinairenvironment,junctiontopackagesurface,jt—In°C/watt,istheThis
5、methodappliesonlytopackageswhosesurfaceistemperaturedifferencefromthejunctiontothecenterwideenoughtoplaceathermocouple.pointonthepackagedividedbythepowerdissipation4ReferencedDocumentsPH.4.1SEMISpecification6SummaryofMethodSEMIG30—TestMethodforJunction-To-CaseTher-Athermocoupleisattachedo
6、nthesurfaceofthepack-malResistanceMeasurementsofCeramicPackagesageonthetestboard.SEMIG32—GuidelineforUnencapsulatedThermalAfterthechipisheated,thejunctiontemperatureisTestChipmeasuredbythediodeinthetestchip.ThesurfaceSEMIG38—TestMethodforStill-andForcedJunc-temperatureismeasuredinanairen
7、vironmentbythetion-To-AmbientThermalResistanceMeasurementsofthermocouple.IntegratedCircuitPackagesThejunction-to-casethermalresistanceiscalculatedSEMIG42—SpecificationforThermalTestBoardusingthecasetemperature,junctiontemperatureandStandardizationforMeasuringJunction-To-Am
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