wire bonding technology

wire bonding technology

ID:40985066

大小:1.63 MB

页数:72页

时间:2019-08-12

wire bonding technology_第1页
wire bonding technology_第2页
wire bonding technology_第3页
wire bonding technology_第4页
wire bonding technology_第5页
资源描述:

《wire bonding technology》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库

1、AdivisionofSPTRothGroupWireBondingTechnologyWireBondingProcessAprocessofinterconnectingthebondpadmetallizationtotheleadpostwithaconductingwiresoastocompletetheelectriccircuitbetweenthechiptotheleadexternaltothepackage.WireBondingProcess(Cont.)BGAQFPWireBondingProcess(Cont.)QFNSm

2、artCardThreetypeofW/BprocessesThermosonicbonding/ballbonding-Heatandultrasonicareappliedtobondtwodifferentmetallicsurfacesunderpressuretoformabond,morethan90%ofallsemiconductorpackagesiswiththisprocessThreetypeofW/BprocessesUltrasonicbonding/wedgebonding-Ultrasonicenergyisapplie

3、dontwometallicsurfacesunderpressuretoformabondThermalcompressionbonding-Seldomusedtoday,butistheoriginaltechnologydevelopedbyBellLabsin1957forelectricalinterconnectionDifferencesBetweenT/S(ThermoSonic)andU/S(UltraSonic)T/SU/SWireAu/CuAl/AuToolCapillaryWedgeBondingTemp.NeedHeatin

4、gRoomTemp.BonderNeedEFODon’tneedEFOLoopingLoopingnon-directionaldirectionalBallBondingSequenceBallBondingSequence(Cont.)BallBondingSequence(Cont.)BallBondingSequence(Cont.)FirstbondKeyattributesòBondpower/force/timeòBondtemperature(thermosonicbondingonly)òBondpadmetallizationtyp

5、eòCapillarydesignòPRSperformanceKeyeffectsòBallshape(size,height)òBondstrengthòCrateringòBallplacementBallBondingSequence(Cont.)BallBondingSequence(Cont.)LoopingKeyattributesòWire(type,size)òTooldesign(clearancebetweentoolinnerdiameterandwire)òLoopingalgorithm/Wirefeedingsystemò

6、HAZòWirespoolingKeyeffectsòLoopheightòWireswayòWiresaggingòWiresweepduringmoldingBallBondingSequence(Cont.)BallBondingSequence(Cont.)SecondbondKeyattributesòBondpower/force/timeòBondtemperature(thermosonicbondingonly)òLFsurfaceòLFclampingòCapillarydesignKeydefectsòLiftedpostòSma

7、shbondòBrokenwireBallBondingSequence(Cont.)BallBondingSequence(Cont.)FirstbondpreparationKeyattributesòWiretaillengthòEFOsettings(ballsizeratio/torchcurrent,torchtime)òEFOgapòThesurfacetensionofthemoltenmetalmaintainsasphericalshapewhilethewirecoolsandsolidifiesKeyeffectsòToosma

8、llballwillresultinpluggingthecapillaryòToolarge

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。