基于厚铜工艺的高性能片上螺旋电感分析

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1、上海交通大学硕士学位论文processflowformanufacturingspiralinductors,fabricated3μmthicktopmetallineson200mmwafer.Thesheetresistance(Rs)ofthethickmetalachieved6milliohms,realizedthegoalofmanufacturinghighperformanceinductors.TestanalysisandModelextraction.Thedissertationemployedtheon-chiphighfr

2、equencytestsystemandtestedlargeamountofon-chipspiralinductorsmadeusingthethickCuprocess.Thetestresultsmatchthedesignspecifications.Thetestresultsshowthattheon-chipinductorwiththeinductanceLof2.2nHachievesthe“Q”valueof16.6undertheworkingfrequencyof2.2GHz.Itsperformanceismuchbetter

3、thantheAluminuminductor.Thisdissertationcompletedtheparameterextractionandsimulationmodelbuildingfordifferentialinductors.Thestudyemployedaphysics-based,completed,andproportionallyvariableinductormodel.The3-Dvariablemodelisabletopreciselypredictlowfrequencycharacteristicsandconta

4、inscorrectedamendedskineffectandproximityeffect.Bycomparingthedifferenceofthesimulationresultsandthemeasurementdataoftheasymmetricinductormodel,themodelcanlowertheQvalueandtheLvalueerrortolessthan10%formostinductors,wellmeetstherequirementsoftheindustry.KEYWORDS:SpiralInductoronc

5、hip，ThickCuprocess，SingleDamascus，Qualityfactor，DoubleπModelingIV万方数据上海交通大学硕士学位论文目录第一章绪论····························11.1引言·················································································································11.2片上电感研究现状及应用······························

6、···············································11.3本课题研究的意义·························································································31.4本课题研究的内容·························································································31.5本论文的结构·····················

7、············································································4第二章片上螺旋电感的理论分析基础·················52.1电感的物理基础···································································································52.1.1电磁感应基本理论··············································

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