注塑指导薄壳技术

(81页)

'注塑指导薄壳技术'
薄殼成型 Thin-wall Molding可攜式電子產品的需求每年成長達30%,今後十年的成長會更快。 由於擁有這種產品的人還很少 - 在美國少於5%,全世界則少於1% - 整個市場大得驚人。The demand for portable electronics has increased by 30% per year, with even faster projected growth in the coming one decade. The current relatively low penetration of these devices - less than 5% of the U.S.A., and 1% of the world’s population - implies the total market for portable electronic devices is tremendous. 薄殼技術 Thin-wall Technology消費電子市場對於更小、更輕、更緊密的電腦、行動電話和其他電子資訊裝置的需求成長快速,使得高功能的薄殼設計變得必要 - 這一要求對於材料商、 產品和模具設計工程師、模具廠、成型廠以及成型機暨附屬設備製造廠都是一大挑戰。A rapid growth in demand in the consumer electronics market for smaller, lighter and tighter computers, cellular phones, and other electronic and communication devices necessitates high-performance housing designs with thinner wall sections - a critical requirement that is challenging material suppliers, part and mold designers, mold makers, and machine & auxiliary equipment manufacturers alike. 薄殼成型Thin-wall Molding 薄殼成型 Thin-wall MoldingTiny latch of dual-row connector 薄殼成型Thin-wall Molding 薄殼成型Thin-wall Molding CD-ROM tray from Philips 薄殼成型 Thin-wall Molding 薄殼成型 Thin-wall Molding 對於可攜式電子產品而言,薄殼使得重量變輕、尺寸減小。 對固定式電子產品而言,薄殼使得成本降低、循環時間縮短,因而生產力提高。For portable electronics, thinner wall sections reduce part weight and size. For stationary electronics, thin-wall technology can help enhance productivity by reducing part cost and cycle time. 薄殼成型 Thin-wall Molding就傳統射出成型而言,實用的最小壁厚在0.75到1.00mm 之間。 如果要採用更薄的壁厚,卻又缺乏實際的經驗,可以借助CAE作科學的決定。For conventional injection molding , a practical minimum wall thickness is in the range of 0.75 to 1.00 mm. When thinner walls are required but actual experience is absent, the minimum possible thickness can be scientifically determined by CAE. 壁厚不均 Non-uniform Wall Thickness產品設計中壁厚不均帶來的麻煩比任何其他問題設計帶來者都要嚴重,這對薄壁產品尤然。 這些麻煩包括了遲滯現象、短射、翹曲、凹陷、發赤等。 這些麻煩都可用CAE以直接或間接的方式預測。A non-uniform wall thickness will cause more trouble than any other problem in part design. This is especially true to thin-wall part. The trouble, including hesitation, short shot, warpage, sink mark, blush, etc., can be predicted, directly or indirectly, by using CAE. 壁厚不均 Non-uniform Wall Thickness設計高收縮率材料成型品時,設計者應將壁厚變化限制在10%。 就低收縮率材料而言, 許容壁厚變化可到25%。While designing injection molded parts in high mold shrinkage factor materials, the designer should try to limit wall thickness variation to 10%. The allowable wall thickness variation for the low mold shrinkage factor materials can be up to 25%. 冷卻時間和厚度分佈Cooling Time and Thickness Profile 差的設計 Bad Design 好的設計 Good Design 4 ? ? ? 2? ? ? 1 1 mm r 0 . 375 ?r 0 . 6 mm ? l wal wall h 4 t ?h 4 t ? wall rib rib wall t t 0 . 6t t ? ?l l a w - n i h T e g d E - g n i d a e L l a n o i t n e v n o C e n i l e d i u G n g i s e D s b i R g n i d l o M l l a w - n i h T 型 成 殼 薄 薄殼成型 Thin-wall Molding為了防止遲滯現象和短射,幾何特徵(如肋、螺柱、角板等)的根部厚度可以等於其相接的壁厚。 當幾何特徵遠離澆口時,傳統設計規則可用。In order to avoid hesitation and short shot, the thickness of the features, e.g. rib, boss and gusset, at it’s root can be as thick as it’s adjacent wall section. When the features are located far from gate, conventional design rules should be applied. 薄殼成型 Thin-wall Molding當壁厚小於1.27mm時,流路末端保壓不足,突出物的厚度應設計為公稱厚度的50%到60%。 澆口附近,保壓壓力大,突出物的厚度可以設計為公稱厚度的75%到100%。When wall thickness is less than 1.27mm, packing pressure may not be enough at the end of the flow path. In these locations, projections should be designed to be 50 to 60% of the nominal thickness. Near the gate, packing pressure is high. Projection in this area can be 75 to 100% of the nominal thickness. 薄殼成型 Thin-wall Molding加纖強化的產品,若想有均勻合理的纖維配向、收縮以及物性,厚度以不小於3mm為宜。當壁厚是1.25mm時,約90%的纖維排列於流向,產品在流向收縮較少。不同方向收縮不一,成型時進入產品的應力增加,翹曲傾向提高。Fiber reinforced parts will have reasonably uniform fiber orientations, shrinkage, and physical properties at wall thicknesses of not less than 3 mm. At a wall thickness of 1.25mm, approximately 90% of the fiber
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