TP量产与测试知识大全-TLSC6x06系列.pdf

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1、应用文档：泰凌微电容屏工厂量产和测试指导AN‐CTP‐TP‐C1Ver1.02TELINK2013/8/15关键词：量产；FPC测试；Sensor测试；半成品测试；SEMICONDUCTOR成品测试；不良品分析；测试软件；测试主板；转接板；硬件连接；配置文件简介：本文档介绍了TP的量产测试流程，适用于所有基于泰凌微Matrix系列触控IC（含自电容芯片TLSC6306/TLSC6206，互电容芯片TLSC960/TLSC968）进行的TP项目。应用文档：泰凌微电容屏工厂量产和测试指导PublishedbyTelinkSemiconductorBl

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6、elink‐semi.comAN-CTP-TP-C11Ver1.02应用文档：泰凌微电容屏工厂量产和测试指导版本历史版本主要变动日期作者1.0初始版本2014/6/26张玉忠，江晨1.01修订测试流程部分2014/7/19程国凡1.02示例图片更新，术语修订2014/8/15程国凡，王广任何技术问题，请联系泰凌微电子电容屏FAE团队：上海：浦东新区张江高科技园区祖冲之路1500号3号楼深圳：南山区科技南十二路方大大厦1707Tel:+86‐755‐86155312AN-CTP-TP-C12Ver1.02应用文档：泰凌微电容屏工厂量产和测试指导目录

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