SMT元件焊接标准.pdf

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1、CorporateQualityStandardNumber:Title:Date:29007-BWMS-Soldering(Part2:SurfaceMountedComponents)1.0Contents目录Page1.0Content目录----------------------------------------------------------------------------------------12.0Purpose目的----------------------------

2、------------------------------------------------------------13.0Scope范围----------------------------------------------------------------------------------------14.0Description定义14.1Tools&Equipment工具和设备----------------------------------------------------

3、------14.2SolderJointforSurfaceMountedComponents2表面贴装元件的焊接-------------------------------------------------------------------------4.2.1ChipComponent片状元件--------------------------------------------------3-74.2.2CylindricalDevices圆柱形元件------------------

4、--------------------------8-94.2.3LCCDevices--------------------------------------------------------------------10-114.2.4PLCCDevices------------------------------------------------------------------12-154.2.5SOICDevices(Gull-Wing)---------------------

5、------------------------------16-174.2.6QFPDevices(Gull-Wing)----------------------------------------------------18-214.2.7FlushTerminations----------------------------------------------------------224.2.8PartialWraparoundTerminations(TantalumCapacitor

6、)-------------23-254.2.9RoundConductor--------------------------------------------------------------26-274.2.10SolderBalls----------------------------------------------------------------------284.2.11SolderSplash&SolderWebs-----------------------------

7、------------------294.2.12BallArrayGrid(BGA)30-314.2.13IllustrationonAcceptableSolderingRequirements32-334.2.14IllustrationonRejectableSolderingRequirements34-425.0Reference参考资料---------------------------------------------------------------------------

8、-----436.0Remarks备注--------------------------------------------------------------------------------------437.0RevisionHistory版本-------------------------------------------------------------------------------438.0Approval批准---------------