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1、ANSYS在HFSS3DLAYOUT中完成PCB与三维器件联合仿真12©2015ANSYS,Inc.March3,2016ANSYSConfidentialANSYS中国aAgenda•3DComponents•HFSS3DLAYOUT12©2015ANSYS,Inc.March3,2016ANSYSConfidential•LayoutDrivenSystemVerificationANSYS12©2015ANSYS,Inc.March3,2016ANSYSConfidentialAssemblyof3DComponentsAssemblyof
2、3DComponentsANSYSDevice12©2015ANSYS,Inc.March3,2016ANSYSConfidential12©2015ANSYS,Inc.March3,2016ANSYSConfidential•设计复用•上下游设计共享•包含所有细节3DComponents•参数化设计•知识积累•模型加密12©2015ANSYS,Inc.March3,2016ANSYSConfidential3DComponent的全新特性见＞不可见部分的所有特性仍然会在仿真中体现1ue砌LODpQfWHCV/ithUserPassword®VV
3、ithInternalKey＞创建者可以决定哪些部件是可INwne
4、IncliKieI卜■」了」ANSYS10©2015ANSYS,Inc.March3,2016ANSYSConfidentialShe^■画Agenda•3DComponents•HFSS3DLAYOUT•LayoutDrivenSystemVerificationANSYS10©2015ANSYS,Inc.March3,2016ANSYSConfidentialHFSS3DLayout的优势•AccurateSolution-Industryleadingmeshingcapa
5、city-Causal/Passives-parameters一TrueDCsolution-EmbeddedRLCors-parametercomponents•FastSimulations一Reducesmulti-daylongsimulationstoafewhoursorless•Easeofuse-3DLayout-Easytranslation,importandsetup-MaintainstracecharacteristicsandnetsfromlayoutHierarchicaldesign-Chip/Package/B
6、oardEmbeddeddielectriclayersParameterizedmodelforDesign•Tracewidth,layerthickness,viadimensions•Manufacturingtolerances(etchingfactor)•MaterialsANSYS10©2015ANSYS,Inc.March3,2016ANSYSConfidentialHFSS3DLayout的新功能•HFSS3DDynamicLinkinLayout•3DPlacementandPositioning•ImprovedCapac
7、ityandLayoutRendering气tI►，扇tyiiiim—iiTniiir^'i_«Q3OI0201DimAMcil1^411IF1L^OIir0201□idi11^4，"P02CnO^Cn>F02010701i?rQ2O1"•i.e«ai2r020«02017LinearNetworkAnalysisforCo-simulation•LNASetupandautomatedNetlisting♦ComponentModelsSlwavetechnologyforlargePCBsandpackages•SYZSolver•Geome
8、tryChecksANSYS10©2015ANSYS,Inc.March3,2016ANSYSConfidentialAgenda•3DComponents•HFSS3DLAYOUT•LayoutDrivenSystemVerificationANSYS10©2015ANSYS,Inc.March3,2016ANSYSConfidentialPCB与三维器件的集成Layout-DrivenAssemblyinANSYSElectronicsDesktopPlaceandconnectcomponentsinLayoutECADandMCADSim
9、ulatecomponentswith3DaccuracyHFSS,Slwave,Q3DApplyautomatedcircuitsim
