大功率某某散热用陶瓷金属基板的制备与性能分析

《大功率某某散热用陶瓷金属基板的制备与性能分析》由会员上传分享，免费在线阅读，更多相关内容在学术论文-天天文库。

1、重庆大学硕士学位论文obtainabetterCucoatingunderannealing300℃andactivation25min.④ThethermalresistanceofAlandAlNceramicsubstratepackagingGaN-LEDlampwas10.61℃/Wand2.71℃/W,andtheinfrarytestingtemperaturewas77℃and63℃,respectively.⑤Comsolmultiphysisoffiniteelementmodelwasusedtosimulationthetemperat

2、ureandcurrentdensitydistributionofAlandAlNceramicsubstratepackagingGaN-LEDlamp,andtherelativeerrorstoexperimentalresultswas0.92%and0.60%.⑥Finiteelementsmethodsareusedtoinvestigatethermal-electricalcharacteristicsofgallium-nitride(GaN)light-emittingdiodes(LED)withdifferenttransparent

3、conductivelayers(TCLs)andelectrodesburieddepth,wheretransparentconductivelayersincludeindiumtinoxide(ITO),graphene(Gr)andthecombinationofthem(ITO/Gr).TheresultsindicatethatLEDwithTCLof100nmITOor4-layersGrhasagoodthermal-electricalperformancefromthepointofviewofthemaximumtemperaturea

4、ndthecurrentdensitydeviationofmultiplequantumwell(MQW).ThecompoundTCLwith20nm-ITOand3-layersGrreachestoabetterthermal-electricalperformance.Theelectrodesburieddepthis0.51μm,thethermal-electricalperformanceoftheGaN-LEDcanbefurtherimproved.Keywords:electrolesscopperplating,adhesionfor

5、ce,electricconductivity,thermalconductivity,finiteelementmodelIV目录目录中文摘要................................................................................................................................................I英文摘要..............................................................

6、...............................................................................III1绪论...............................................................................................................................................11.1引言.................................................

7、...............................................................................................11.2LED散热问题简介........................................................................................................................31.2.1LED基本机理..........................................

8、...................