光电子封装用金锡焊片的制备

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1、华中科技大学硕士学位论文摘要金锡焊料是一种广泛应用于光电子封装和高可靠性军用电子器件焊接的贵金属焊料，其中金锡共晶焊料熔点最低，含金量为80%。金锡焊料本身强度高，抗氧化性能好，抗热疲劳和蠕变性能优良，熔点低，流动性好。这些优点使得其成一种光电子器件封装的最佳焊料之一，但其脆性大，不易制备和成本过高的因素制约着其发展，所以金锡焊料的制备研究受到被各国学者关注。本文分别通过金锡叠层和合金增韧的方法实验制备出了表面质量好，厚度可控的金锡焊片，并通过一种光纤管壳焊接用的规定尺寸焊环的制造来研究金锡焊片的制备工艺，这种焊环的外经1.0mm，内径0.4mm，厚度0.4

2、mm，要求焊环尺寸精确，成分准确。金锡叠层法主要是利用金层和锡层之间的扩散，将金层和锡层按80:20质量比交相叠层复合，后室温压延成所需规格的焊片，这样制备的焊片延展性很好，利于后续加工和冲裁。合金增韧法是利用对金锡共晶合金焊料进行铸造、热压延、热处理等一系列工序使焊片成形，制作出不同厚度的箔材，并降低焊片脆性，增加焊片韧性。然后通过设计与改进模具，冲裁出合乎质量要求的金锡共晶合金焊环。最后选择较好的制备方法设计提出了一整套金锡焊片焊环工业生产方案。关键词：金锡合金，制备，叠层，共晶，热压延，热处理。I华中科技大学硕士学位论文AbstractAu-Snsol

3、der,akindofpreciousmetalsolder,isoftenusedinoptoelectronicpackageandmilitaryelectronicmodulewithhighreliability.Meltpointofthesolderwith20%SnandthebalancedAuisverysmallandthiscomponentpointisaeutecticpoint.Au-Snsolderhaslargestrength,fineant-oxidation,smallmeltpoint,lowliquidity,ex

4、cellentheatfatigueandcreepdeformationresistant.ThesemeritsmakesAu-Snsoldertobeoneoftheperfectsoldersusedinoptoelectronicpackage.Butit'ssofragilethatcan'tbemanufacturedbynormalmethod.Itshighpriceanddifficultmanufactureinhibititsowndevelopment,soit'sattractedmoreandmoreattentionbyman

5、yscholarsfromdifferentcountries.Thistextrevealstowmethods,goldandtinlaminationmethodandalloymethod,tomakeperfectAu80Sn20solderfoilwithallkindsofthickness.ThemanufacturemethodofAuSn20solderfoilisresearchedbypre-producingAuSn20solderringwith1.0mmexternaldiameter,0.4mminternaldiameter

6、and0.4mmthicknesswhichhasfinedimensionalaccuracyandexcellentcomponent.LaminationmethodisappliedbyusingthediffusebetweenAufoilandSnfoilwhichlaminatesAuandSnwitharatio-80:20,afterwardrollingsolderfoilwhichhastherequiredspecification.Thesolderfoilswhichareproducedbytheformermethodbear

7、fineductibilitytobeinfavorofcontinuedprocessingandpunching.Thissolderhasfineductility,andbenefitafterprocessandblanking.AlloymethodisthatfoundryofAuSn20alloy,heatrollingandheattreatmentmakesoldershapedwithdifferentthicknessandminimizesolder'sbrittleness,thenacceptedAuSn20solderring

8、ismadebydesigningandamelio