High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产

High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产

ID:39065824

大小:899.28 KB

页数:6页

时间:2019-06-24

High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产_第1页
High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产_第2页
High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产_第3页
High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产_第4页
High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产_第5页
资源描述:

《High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库

1、High-performancePrintedCircuitBoardProductionEquipmentforUltra-highDensityMulti-layerWiring216High-performancePrintedCircuitBoardProductionEquipmentforUltra-highDensityMulti-layerWiringNorioMichigamiOVERVIEW:RecentyearshaveseendramaticprogressintheperformanceMasatoshiYamagaof

2、electronicdevicessuchasmobilephones,notebookPCs,andelectronicbooks.TheseperformanceimprovementsrequirenotonlytheminiaturizationMasahiroKawamuraandperformanceenhancementofthesemiconductorsandothercomponentsOsamuKuzeusedinthesedevicesbutalsotheabilitytoachievehigherdensities,mu

3、lti-ShigeoNakamuralayerstructures,andsmallerholediametersinthePCBsonwhichthesecomponentsaremountedtoformelectroniccircuits.AsamanufacturerofproductionmachineryforPCBs,HitachiViaMechanics,Ltd.suppliesmechanicalandlaserdrillingmachinesabletodrillsmall-diameterinterlayerconnecti

4、onholeswithhighspeedandprecisionanddirectexposuremachinescapableofproducingtheveryfinewiringandhighprecisionneededforhigherwiringdensities.ThesemachinesaresuppliedtothePCBindustrythroughouttheworldwheretheycontributetoimprovementsintheperformanceofelectronicdevices.INTRODUCTIO

5、NforsmallerdiametersandhigherprecisionintheTHEtrendtowardproducingPCBs(printedcircuitmachiningofinterlayerconnectionholesonPCBsbyboards)withhigherdensitiesaselectronicproductsmechanicalandlaserdrillingmachines.havebecomemoresophisticatedisdrivingdemandMeanwhilethecircuitpatte

6、rnsproducedbythePrintedwiringboardswithsmallerholeMachineperformanceimprovementdiametersandhigherprecision(1)Higherprecision(1)Smallerconductorwidths(higherprecision)Lighterelectronicdevices(2)Smallerdiameters,finerlinedimensions(2)Smallerdiameterthroughholes,withhigherperfor

7、mance(3)Higherspeedlargernumbersofholes(3)Multi-layerThroughholeHigh-densityPWBsMobilephoneMechanicaldrillingmachineNotebookPCBlindholeCross-sectionofhigh-densitymulti-layerPWBCircuit(wiring)DigitalcameraLaserdrillingmachineDryfilmexposuresampleSemiconductorpackageThroughhole

8、BlindholeThroughhole:MechanicaldrillingmachineBlindhole:Laserdrillin

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。