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ID:39065824
大小:899.28 KB
页数:6页
时间:2019-06-24
《High-performance Printed Circuit Board Production Equipment for Ultra-high Density Multi-layer Wiring高性能印刷生产》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、High-performancePrintedCircuitBoardProductionEquipmentforUltra-highDensityMulti-layerWiring216High-performancePrintedCircuitBoardProductionEquipmentforUltra-highDensityMulti-layerWiringNorioMichigamiOVERVIEW:RecentyearshaveseendramaticprogressintheperformanceMasatoshiYamagaof
2、electronicdevicessuchasmobilephones,notebookPCs,andelectronicbooks.TheseperformanceimprovementsrequirenotonlytheminiaturizationMasahiroKawamuraandperformanceenhancementofthesemiconductorsandothercomponentsOsamuKuzeusedinthesedevicesbutalsotheabilitytoachievehigherdensities,mu
3、lti-ShigeoNakamuralayerstructures,andsmallerholediametersinthePCBsonwhichthesecomponentsaremountedtoformelectroniccircuits.AsamanufacturerofproductionmachineryforPCBs,HitachiViaMechanics,Ltd.suppliesmechanicalandlaserdrillingmachinesabletodrillsmall-diameterinterlayerconnecti
4、onholeswithhighspeedandprecisionanddirectexposuremachinescapableofproducingtheveryfinewiringandhighprecisionneededforhigherwiringdensities.ThesemachinesaresuppliedtothePCBindustrythroughouttheworldwheretheycontributetoimprovementsintheperformanceofelectronicdevices.INTRODUCTIO
5、NforsmallerdiametersandhigherprecisionintheTHEtrendtowardproducingPCBs(printedcircuitmachiningofinterlayerconnectionholesonPCBsbyboards)withhigherdensitiesaselectronicproductsmechanicalandlaserdrillingmachines.havebecomemoresophisticatedisdrivingdemandMeanwhilethecircuitpatte
6、rnsproducedbythePrintedwiringboardswithsmallerholeMachineperformanceimprovementdiametersandhigherprecision(1)Higherprecision(1)Smallerconductorwidths(higherprecision)Lighterelectronicdevices(2)Smallerdiameters,finerlinedimensions(2)Smallerdiameterthroughholes,withhigherperfor
7、mance(3)Higherspeedlargernumbersofholes(3)Multi-layerThroughholeHigh-densityPWBsMobilephoneMechanicaldrillingmachineNotebookPCBlindholeCross-sectionofhigh-densitymulti-layerPWBCircuit(wiring)DigitalcameraLaserdrillingmachineDryfilmexposuresampleSemiconductorpackageThroughhole
8、BlindholeThroughhole:MechanicaldrillingmachineBlindhole:Laserdrillin
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