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1、Methodsanddesignsforimprovingthesignalintegrityfor3DelectricalinterconnectsinhighperformanceICpackaging#*BopingWu,HaogangWang#DepartmentofElectricalEngineering,UniversityofWashingtoninSeattleStevensWay,Seattle,WA98195,USAbennywu@uw.edu*DepartmentofInform
2、ationScienceandElectronicEngineering,ZhejiangUniversityZhedaRoad,Hangzhou310027,Chinahgwang@zju.edu.cnAbstract—Designofhighperformancepackageinterconnectscompulsoryandimportantforpackageanalysis[3-5].Theusingfull-waveelectromagneticsolversisnecessaryduet
3、overticalinterconnectinsideapackagecorelayersubstrateareincreasedoperationspeed,miniaturizationandvertical3Dplatedthrough-holes(PTHs).Sucha3Dstructurecontributesintegration.Thusthesegmentedstudyandoptimizationisheavilytothedegradationofthechannelperforma
4、nce,becominginevitablefordesignerstoimprovethesignalintegrityincreasingreflectionsandreducingthebandwidth.ThereforeofICpackaging.Thispaperaddressesalternativemethodsanditisimperativethatschemesbedevelopedtooptimizetheoptimaldesignsonseveralcomponentsands
5、tructuresforpackageelectricalinterconnect,includingvoidingtechnique,dimensionsofthevariousfeaturesoftheseverticalpadlessviaimplementation,spiralmicro-viastackingandinterconnects.signal/groundlayoutpatterns.ThesimulatedtimedomainresultsWithhighspeedtransm
6、issions,aPTHproducescapacitivehavebeenpresentedtodemonstratetheimprovementsofloading,mainlyduetothelargepadsatthePTHends,whichoptimizedschemes.Thesemethodologiescouldbetreatedasleadstoimpedancemismatchandsignaldiscontinuity.Onthehandyreferencesandgeneral
7、guidelinesappliedtodifferentialotherhand,asetofmicro-viastructuresusuallyliesontoppackagelineresultinginasignificantimprovementofoveralland/orbottomofthePTH.Althoughshownasrisingvertically,packagesignalintegrityperformance.stackedmicro-viasinextralayersm
8、ayriseatananglefromvertical,potentiallytocontributetotheinductiveeffect.TheKeywords-3Dpackaging,verticalinterconnect,signalintegrity,numberofriselayersmaydependonthenumberofdielectricplatedthrough-hole,micro-vialayersneede