欢迎来到天天文库
浏览记录
ID:41008410
大小:3.86 MB
页数:85页
时间:2019-08-13
《集成电路芯片的失效机理》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、faprl专题1-电子产品的失效机理集成电路芯片的失效机理JingsongXie,Ph.D.FailureAnalysis&PhysicsResearchLab.(FAPRL)北京航空航天大学可靠性工程研究所2008年10月29-31日FailureMechanismsofICDevicesfaprlThemostsignificantphysicalfailuremechanisms(intrinsicfailure)inmodernelectronicdevices:•Electromigration(EM)•Hotca
2、rrierinjection(HCI)•Time-dependentdielectricbreakdown(TDDB)•Negativebiastemperatureinstability(NBTI)faprlElectromigration(EM)/StressVoidingElectrical:金属线中的电迁移faprlElectromigrationinanaluminumElectromigrationinthealuminumintegratedcircuittrackwithconductorofapowertr
3、ansistorhaspreferentialmigrationatgrainbuiltupaluminumattheleftandboundaries.depleteditontheright.ElectromigrationanditsPhysicsProcessfaprl•Electromigrationisthedominatingfailuremodeofinterconnects.Itischaracterizedbythemigrationofmetalatomsinaconductorthroughwhich
4、largedirect-currentdensitiespass.•AsICtechnologyincreasesdevicedensity,theinterconnectsthatcarrysignalsareconsequentlyreducedinsize,specifically,inheightandcrosssection.Thisleadstoextremelyhighcurrentdensities,ontheorderofatleast106A/cm2.•Atthesecurrentdensities,mo
5、mentumtransferbetweenelectronsandmetalatomsbecomesimportant.Thetransfer,whichiscalledtheelectron-windforce,resultsinamasstransportalongthedirectionofelectronmovement.EMFailureProcessfaprlDiffusionBarriersfaprlElectrical:在机械力作用下产生的空洞faprlStressvoidsinamicrowavepower
6、Stressvoidsinaluminumtracksofatransistorhavereducedtheconductormemorycircuit(afterremovalofthewidthssufficientlytomakethemglasscoating).vulnerabletoelectromigration.faprlHotCarrierInjection(HCI)HotCarrierInjectionMechanismsfaprl•Channelhotelectron(CHE)injection•Dra
7、inavalanchehotcarrier(DAHC)injection•Secondarygeneratedhotelectron(SGHE)injectionHotCarrierGenerationandDegradationinMOSFETsfaprlHotCarrierInjectionMechanisms-ChannelHotfaprlElectron(CHE)Injection•Channelhotelectron(CHE)injection:CHEinjectionisduetotheescapeof“luck
8、y”electronsfromthechannel,causingasignificantdegradationoftheoxideandtheSi−SiO2interface,especiallyatlowtemperature(77K).Channel-hot-electroninje
此文档下载收益归作者所有