【精品】常用专业术语.doc

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1、常用PCB專業術語裁板Cutlaminate&baking鑽孔Drillinghole鍍通孔Platedthroughhole鍍銅（化學銅&—銅）Electrolesscopper&firstcuplating影像轉移Imagetransfer幹膜Dryfilm底片Film鍍銅錫蝕刻Tin-leadplatingCopperetching鍍鎳金Ni/auplating防焊Soldermaskprinting液態感光Liquidphotogenes曝光Exposure文字Legendprinting噴錫Hotairleveling沖床Punching電腦成型NcRouting切割v-cut松香

2、Flux成品測試o/stest(Open/ShortTest)治具Fixture成品檢驗Finalinspection包裝岀貨Packing&Shipping完工產品管制End-productControl制程中管制In-ProcessControl制程管制ProcessControl品質合規檢驗QualityConformanceinspection品質保證QualityAssurance產品交貨檢驗InspectionofProductforDelivery原材料檢驗MaterialInspection零件孔ComponentHole零件面Componentside焊錫面Soldersi

3、de孔環Pad線寬ConductorWidth線距ConductorSpacing耐燃性FlameResistant單面板Singleside雙面板Doubleside網版印刷Screenprinting接腳/插銷/插針Pin陰影GhostImage孔位破出Holebreakout線Opencircuit刮痕Scratches凹陷Dents板彎•板翹BowandTwist燒焦Burning漏印SkipPrinting漏鍍SkipPlating微SilverConductivesMicroetchCopperFoil美國印刷電路板協會InstituteofPrintedCircuit(IPC)

4、電鍍制程PlatingProcess最終表面處理FinalFinish線寬公差ConductorWidthTol.間距公差ConductorSpacingTol.介質層厚度DielectricSeparation有機保焊劑OrganicSolderAbilityPreservatives(OSP)截面之線路間距LateralConductorSpacing標記油墨MarkingInk防焊綠漆焊錫性試驗SolderResistSolderAbilityTest金屬箔MetalFoil裸銅錫鉛層BareCopperTin-Lead焊錫皮膜SolderCoating鍍鎳層NickelPlating

5、鍍金GoldPlating鍍層附著力PlatingAdhesion板邊金手指EdgeBoardConnectorLands基材破裂LaminateCracks綠漆厚度SolderResistThickness連通性Continuity隔絕性Isolation（特性）阻抗試驗(Characteristic)ImpedanceTestingc=o抽樣計劃C=0SamplingPlan尺度安定性DimensionalStability抗撓性強度FlexuralStrength抗撕強度PeelStrength耐電弧性ArcResistanee電性強度ElectricStrength透電率Permit

6、tivity表面電阻率SurfaceResistivity體積電阻率VolumeResistivity吸水性WaterAboorption介質強度DielectricStrength化學銅ElectrolessCopper直接電鍍DirectPlating塞孔Plugging線路油墨PatternInk蓋孔法Tenting二次鑽SecondDrill毛頭Burr晶片Chip打線WireBonding平行光CollimatedLight板角標記CornerMark微切片Microsectioning裂痕Crack停置時間HoldingTime缺口Nick探針Probe鉄刀RouterBit水洗

7、沖洗Rinsing刮刀Squeege良品率Yield多層板MultiplayerBoard(MLB)氧化OxidationPCB一PrintedCircuitBoardWP-WorkingPanalPNL-PanalPCS-PiecesIPQC-InspectionProcessQualityControlCOB—ChiponBoardD:雙面板S:單面板M:多層板H:噴錫A:鍍金C:銅箔G:金手指N:鍍鎳D