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1、沧州福林印制电路板有限公司pcb参数（CangzhouFulinprintedcircuitboardCo.,Ltd.PCBparameter）Designrequirementsforprintedboards1..CAMdesignrequirements(belowaregeneralrequirements,exceptforspecialrequirements)1.track1.1linewidth/linedistance>0.15mm,patterndistance,plateedgespacing>
2、0.2mm(V-CUT>0.35mm)1.2whentheinneredgeiscoveredwithalargeareaofcopperfoil,theinneredgeoftheinneredgeisleftatleast0.5mmisolationregion1.3installationholes,positioningholes,aroundthehole,leavingthe0.5mmisolationarea1.4devicehole,minimumringwidth0.175mm,generalcon
3、dition:Sizeofrequirementspad--------------------------------0.8mm55milAm0.9mm60milThe1.0mm65milThe1.1mm70mil----------------------------------1.2mm75mil----------------------------------1.5mmm90mil------------------------------------Thedesignprincipleofthesizeo
4、ftheinnerlayerofthemultilayerboardshouldbeaslargeaspossible.Theoptimumsizeis2.2mm,whichisusually0largerthantherequiredaperture.7mm,thesizeoftheheatsinkisshowninfigure:Thedirectionoftheabnormalholemustbeclear,andtheminimumringwidth0.5mm.isallowedwhenthespacingis
5、allowed1.5requiretheboardtohaveatleast2millingholesindiameter>1.5mm2..SolderresistTheresistanceweldingpadislargerthanthelinepad(0.15-0.2mm),Andthedistancebetweenthesolderpadsandthelinespacingis>3mil3.characterslice3.1charactergraphicscannotcoverthesolderandsold
6、erjoints,thedistancebetweenthepads/pads>0.3mm.3.2characterlinewidth>0.15mm,fontsize1.0mmormoreTwo.Processdefectsinprintedcircuitdesign1.padoverlap1.1causingheavyholesindrillingbecauseofrepeateddrillingatoneplaceresultinginfractureandholedamageInthe1.2multilayer
7、plate,thereisaconnectingplateandaisolatingplateinthesameposition,andtheboardisisolatedandconnected2.graphicslayerisnotused2.1,contrarytoconventionaldesign,suchascomponentsurfacedesignintheBOTTOMlayer,weldingsurfacedesignintheTOPlayer,causingmisleading2.2therear
8、ealotofdesigngarbageonalllevels,suchasbrokenlines,uselessborders,labelsandsoon3.charactersarenotreasonable3.1characterscoverSMDsolderpads,whichmakePCBpassdetectionandcompone
