电子封装材料之功能陶瓷_下篇(electronic packaging materials of functional ceramics _ )

电子封装材料之功能陶瓷_下篇(electronic packaging materials of functional ceramics _ )

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时间:2018-07-17

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1、电子封装材料之功能陶瓷_下篇(Electronicpackagingmaterialsoffunctionalceramics_2)Electronicpackagingmaterialsoffunctionalceramics_the.TxtComrades:donotinvestinstocks,theriskistoobig,ortofu'ssafety!Dothehard,itisdriedbeancurd,dodiluteisbeancurdbrain,dothinisbeancurdskin,donothaveissoyabeanmilk,putsmelly,itissmel

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3、eadtomutualprovideelectrodesemiconductorelement,semiconductorchip,resistorsandcapacitorswithmetallizedcircuitcomponents,andtoensuretheconnectionbetweenthemetalsemiconductorohmiccontacts,requirements:thebindingsiteofmetalandsemiconductornottoformabarrierforNtypesemiconductorandtheworkfunctionofthe

4、metalsemiconductorworkfunctionthanforsmallPtypesemiconductor,theoppositeofmetalandsemiconductorwiththespacechargelayerofthewidthisnarrow,electronsdirectlyfromthemetalandsemiconductormigrationlimitetc.2.FilmmaterialConductivefilmmaterial;resistorfilmmaterial;dielectricfilmmaterial;functionalfilmma

5、terial2.Filmmaterial,conductorfilmmaterialThekindofmaterialpropertiesandtheactualsituationwithsurfacetreatmentinsemiconductor,conductorandsemiconductorsurfaceoftenhavethinoxidefilm,buttheelectroniceffectcanbethroughthetunnelthroughthefilm,sothereisnobigproblemaccordingtodifferentsurfacetreatmentc

6、onditions,thesurfacestateofasemiconductorwillchangetheworkfunctionofthecorrespondingmetalandsemiconductorwillchangetheworkfunctionandsurfaceenergy,crystalorientationandotherrelated,mustpayattentiontoitsvaluechanges2.Filmmaterial,conductorfilmmaterialTheconductormaterialtypesandpropertiesofotherwi

7、ringandelectrode,shouldalsohavethefollowingcharacteristics:highconductivityofcircuitelementdoesnotproduceharmfuleffects,asohmicconnectionhighthermalconductivity,highmechanicalstrength,fortheelectrochemicalreactionofalk

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