smt词汇和知识

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1、1部品部-Components&PartsCertificationDeptPMC2设计所（研发）－R&D3生产技术部-AdvanceOperationsEngineeringAOE4动力设备部-MotivityFacilityManagementDept5计划部PlanningDep6采购中心PurchasingCentermanualmount手贴无铅焊料定义Lead-freeSolderDefinitions无铅元件表层ComponentSurfaceFinishesforLead-free无铅焊接设备MachinesforLead-Freeso

2、ldering无铅焊接对元件焊点可靠性的影响EffectsofLead-freesolderingonSolderJointReliability无铅焊点可靠性测试和数据分析Lead-freeSolder-jointreliabilityTestsandDataAnalysisPCBPrintedCircuitBoards波峰焊接工艺WaveSolderingTechnologySMT组装工艺和SPCSMTAssemblyProcessandSPC高产量SMT工艺的关键因素KeyFactorsforHigh-YieldSMTprocess焊料成分对润湿

3、的影响EffectofElementalConstituentsonWetting杂质对焊接的影响EffectofImpuritiesonsoldering焊膏工艺SolderPasteTechnology锡粉SolderPowder锡膏流变学SolderPasteRheology锡膏成分和制造SolderPasteComposition&Manufacturing回流前SMT问题SMTProblemsOccurredPriortoReflow助焊剂分离FLUXSeparation焊膏硬化PasteHardening网板寿命问题PoorstencilL

4、ife印刷厚度不理想PoorPrintThickness焊球凸点SolderBumps锡膏脱离刮倒问题PoorpasteReleaseFromSqueegee印锡模糊Smear印锡不足Insufficiency针孔堵塞NeedleClogging塌落Slump低粘性LowTack粘性时间短ShortTackTime回流过程中的SMT问题SMTProblemsOccurredDuringReflowAI:Auto-Insertion自动插件AQL:acceptablequalitylevel允收水准ATE:automatictestequipment自动

5、测试ATM:atmosphere气压BGA:ballgridarray球形矩阵CCD:chargecoupleddevice监视连接元件(摄像机)CLCC:Ceramicleadlesschipcarrier陶瓷引脚载具COB:chip-on-board晶片直接贴附在电路板上cps:centipoises(粘度单位)百分之一,厘泊CSB:chipscaleballgridarray晶片尺寸BGACSP:chipscalepackage晶片尺寸構裝CTE:coefficientofthermalexpansion热膨胀系数DIP:dualin-linep

6、ackage双内线包裝(泛指手插元件)FPT:finepitchtechnology微间距技术FR-4:flame-retardantsubstrate玻璃纖維膠片(用來製作PCB材質)IC:integratecircuit積體電路IR:infra-red紅外線Kpa:kilopascals(壓力單位)LCC:leadlesschipcarrier引腳式晶片承載器MCM:multi-chipmodule多層晶片模組MELF:metalelectrodeface二極體MQFP:metalizedQFP金屬四方扁平封裝NEPCON:NationalElec

7、tronicPackageandProductionConference國際電子包裝及生產會議PBGAplasticballgridarray塑膠球形矩陣PCBprintedcircuitboard印刷電路板PFCpolymerflipchipPLCCplasticleadlesschipcarrier塑膠式有引腳晶片承載器Polyurethane聚亞胺酯(刮刀材質)ppmartspermillion指每百萬PAD(點)有多少個不良PAD(點)psiounds/inch2磅/英吋2PWBrintedwiringboard電路板QFP:quadfla

8、tpackage四邊平坦封裝SIP:singlein-linepackageSIR:surf