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1、摘要本课题的目的在于研究无染料酸性镀铜的工艺新配方。通过对MN(M、N、SPS、PE)非染料系列及其各种替代工艺的赫尔槽试验的研究,其基础配方:2-巯基苯并咪唑(M)0.0003~0.0010g/L,聚二硫二丙烷磺酸钠(SPS)0.0320~0.0600g/L,聚乙二醇6000(PE)0.0480~0.1000g/L,四氢噻唑硫酮(H1)0.0160~0.0300g/L,聚乙烯亚胺丙烷磺酸钠(PN)0.0200~0.0400g/L,脂肪胺乙氧基磺化物(AESS)0.0100~0.0200g/L。M在酸铜中是一种良好的中高端光亮剂
2、;SPS在酸铜镀液中作为晶粒细化剂,提高电流密度;H1能够取代M、N,共轭环结构使其能够增大阴极极化,作为整平剂,比N的效果更好;PE是酸铜中的表面活性剂,起到润湿剂和载体的作用;PN和AESS都是强的酸铜走位剂,其中PN是阳离子型的聚合物,在阴极表面与铜离子产生竞争吸附,阻碍铜离子的沉积,使镀层均匀细致。在此基础上经过一系列的研究,添加了N,N-二甲基二硫代氨基甲酰基丙磺酸钠(DPS)0.0300~0.0600g/L,S0.1200~0.2400g/L,P0.0600~0.1000g/L,I0.0060~0.0120g/L。D
3、PS是一种与SPS性能相仿的光亮剂,其氨基与酰基形成共轭键,增强了其在阴极表面的吸附能力,其高温走位能力比SPS强,拓宽了镀层低端的光亮范围。I是低端光亮剂,使低端光亮范围变宽。S和P均是表面活性剂,能够增大阴极极化,提高添加剂的整平能力。动电位扫描结果表明,Q(本试验配方)的阴极极化过电位和极化度比MN的大,比EPI(国外最好的配方)的小;Q阻碍铜离子放电的能力也介于二者中间。所以,Q要想达到EPI的水平还需改进。关键词:酸性无染料赫尔槽试验阴极极化IAbstractAnewcopperelectroplatingbathis
4、found.MN(M、N、SPS、PE)anditssubstituenttechnicsareresearchedbytheHullCellTest.Afteragreatmanyequipments,abasicprescriptionisfound.ItismadeupofM(0.0003~0.0010g/L),SPS(0.0320~0.0600g/L),PE(0.0480~0.1000g/L),H1(0.0160~0.0300g/L),PN(0.0200~0.0400g/L),AESS(0.0100~0.0200g/L)
5、.Misagoodbrightenerinhighcurrentdensityarea.SPSisagrainrefiner,canimprovethecurrentdensity.H1canreplaceMandN;itsconjugateringstructurecanimprovecathodicpolarization.ItisbetterthanNasaleveler.PEisasurfaceactiveagent,asawettingagentandcarrierinacidcopperelectroplating.
6、PNandAESSarebothstrongbrightenerandleveler.PNisacationicpolymer,whichmakescompetitiveadsorptionwithcopperionincathodesurfaceandgetsinthewayofcopperion’sdeposition.Basedonthisprescription,DPS(0.0300~0.0600g/L),S(0.1200~0.2400g/L),P(0.0600~0.1000g/L)andI(0.0060~0.0120g
7、/L)areaddedin.DPSissimilarwithSPS,itsaminoandacylformaconjugatedbond,whichenhancetheadsorptivepoweratcathodesurface.Italsowidenthebrightrangeinlowcurrentdensityarea.Iisabrightenerinlowside,whichcanwidenthebrightrange.SandParebothsurfactant,canimprovecathodicpolarizat
8、ionandotheradditiveagent’slevelingability.Theresultoftheelectropotentialscanshowthatthecathodicpolarizationoverpotentialandpolariza