铜线键合优势和工艺的优化

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1、TheAdvantageandProcessOptimizationforCopperWireBondAbstractRegardingthechip，itisnotonlynecessarybutalsoamust．Itcanalsobesaidthatthesealreferstotheothercasingwhichtheinstalledsemiconductorintegratedcircuituses．Itnotonlyimprovestheprotectionofthechipandenhancedheattransmissio

2、nperformancebutalsolinksthechipsinteriorandexteriorelectricbridgecircuitstandardfunctions．TheleadwireboIldthatholdsthepivotalstatusinthesemiconductorsealfillsallimportantandcomplexassemblyoperation．ChapterIintroducestheroleandcharacteristicsofthesemiconductorpackage；Chapter

3、IIoutlinessemiconductormanufacturingprocess；ChapterIIIdescribesthepositionandcharacteristicsofwirebondingprocess；ChapterIVexpoundstheadvantageofthereplacementofthegoldenwirebycopperwire，includethelowcost,resistanceandIMCgrowth，enhancedmechanicalproperties，betterthermalprope

4、rties；ChapterV汕nnlsl'iesthechallengeofcopperwire-easyoxidation,hardness，easytohavecrackindielectricandSOon；ChapterVIputsforwardtheprocessoptimizationinthepracticalapplication,suchasequipmentforanti—oxidization,theparameteroptimizationforcopperwirecapillary,pressandultrasoni

5、c，bondpadcompositionandthickness，machinetemperaturecontrolandSOon．ChapterVIIstudiesthecommonproblemswhichwouldbeencounteredinproductionandproposetherelateASOlutions；ChapterVIIIanalyzesthereliabilitytestforcopperwirebond．Atlast,toresearchthedevelopdirectionforcopperwirebond．

6、’K呵words：semiconductorpackagingwirebondcopperwirebond·—Writtenby-HANQing-qian．SuperviS司by-HUANGQiu-pingⅡ目第一章序言⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯l1．1半导体封装的魅力⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯··11．2半导体器件封装的概述⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯··11．3半导体封装的作用⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．．．⋯⋯⋯⋯⋯⋯⋯⋯21．4半导体封装的分类⋯⋯

7、⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯·3第二章半导体制程概述⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯·62．1半导体制程简介⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯62．2半导体封装制程简介⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯·72．3半导体产业特性⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯j⋯10‰第三章引线键合工艺地位及其特点分析⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．．．·123．1引线键合工艺⋯⋯⋯⋯⋯⋯⋯．．．⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯．．．⋯123．2引线键合的重要性⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯

8、⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯12，．3．3引线键合对设备的要求⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯13第四章铜线键合的优势⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯⋯