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1、AbstractAbstractWiththedevelopmentofelectronicassembledtechnology,BGAhasbecomeanimportantencapsulatedwayintheminiaturizationprocessingofelectronicproducts.Ithassolvedthecontradictionbetweenthenumberofchippins,thedistanceofeachtwopinsandthevolumeofchipssucc
2、essfullywhenusedthenormalpackage.BGAchippinsdistributeontheplane,onceproblemsoccurincoplanarityoftheBGAchippins,itwillbeeasytocausepoorcontactevenopencircuitwhileweldingchipandPCB.RepairofBGAchipisdifficult,therefore,thecoplanarityinspectionofBGAduringprod
3、uctionisnecessary.Untilnow,thereisnoeffectiveandefficientdetectorhasbeenusedintheproductionofBGAchip.Thispaperprovidesadesignproposalbyexperimentalcompare,whichintegratesoptics,mechanism,electronicandimageprocessingtechnology.Thetheoreticalbasisofthisdetec
4、tingsystemisthephasemeasuringtechnique.Aftertheresearchaboutthelaserinterferencestructurelightinstrument,imagemultipliersystem,precisiontranslationstageandcontrol,researchanddevelopmentofthissystemisfinallyaccomplished.Criticalcomponentsoftheequipmenthaveb
5、eenproduced.Thedetailedresearchcontentsareasfollowed:1.Laserinterferencetechnologycombinedwithphasemeasurementtechnologybylateralshearinterferencemethod.Thesystemoflaserinterferencestructurealsohasbeendesigned.2.Thecollimatedandbeamexpandedlensandtheimageo
6、pticalgrabbersystemaredesignedandanalyzedbyusingtheOSLOopticalsoftware.3.Considerthedemandofdetectionsystem,thecharacterofscanningtechniqueandthedemand,akindofone-dimensionalscanningsystemwithhighprecisionhasbeendesigned,thedesignofcontrolcircuitalsoaccomp
7、lished.4.ThefunctionandapplicationfeaturesofcoplanarityinspectiondeviceofBGAsolderballsaredemonstratedbyexperiment.Elementarydisposehasbeendoneintheimageswhichcollectinexperiment,feasibilityofthisdetectionmethodalsohasbeenverify.Afterresearchoftheoryandpra
8、ctice,thecharactersofefficient,untouchedandhighprecisionisdemonstrated.Thisresearchprovidesafirmfoundationtocommercializeinthefollowyears.Keywords:BGAchip;coplanarityinspection;laserinterferencestructurelight
