Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf

Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf

ID:34316472

大小:1.93 MB

页数:63页

时间:2019-03-04

Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf_第1页
Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf_第2页
Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf_第3页
Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf_第4页
Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf_第5页
资源描述:

《Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库

1、BergquistTheWorldLeaderInThermalManagementTechnologyOSRAMLLFYWORKSHOPOCT28,2010MCPCB’sandThermalInterfaceMaterialConsiderationsforHighPowerLEDLightingApplicationsSteveTaylorSr.FieldApplicationsManagerThermalSubstratesDivisionTheBergquistCompanyAcknowledgements:JustinKolbe–Sr.DevelopmentE

2、ngineer,BergquistCompanySanjayMisra–DirectorofResearch&Development,BergquistCompanyBergquistTheWorldLeaderInThermalManagementTechnologyMCPCB’sandTIMConsiderationsforHighPowerLEDLightingApplicationsOutlineThermalmanagementiskeytoyourdesignThermalperformanceofhighpowerLED’sUnderstanding

3、thermalperformance(referencedata)MCPCBmaterialoptionsandpartgeometryTIMselectionconsiderations,optionsthatareavailableConclusionsBergquistTheWorldLeaderInThermalManagementTechnologyImportanceofThermalManagementofHighPowerLED’sOnly~15-30%ofinputpowerisconvertedtolightTheremaining70-8

4、5%ofinputpowerisconvertedtoheatExcessiveheatcancauseashiftincolorExcessiveheatcanreducelightoutputExcessiveheatcanshortendevicelifeIESNAHandbookOsramSylvaniaSource:PNNL-SA-51901,February2007BergquistTheWorldLeaderInThermalManagementTechnologyModelresultsComparisonofFR-4toIMSGoodtherma

5、lmanagementresultsinlowerjunctiontemperatureBergquistTheWorldLeaderInThermalManagementTechnologyCasestudyresultsThermalimpedanceofOsramDiamondDragononvarioussubstratesThermalResistanceofOsramDiamondDragononVariousSubstrates98765–IllustrationfromOsramDiamondDragonliteratureC/Wo432102layer

6、FR49holes2layerFR418holes1.1W/mK2.2W/mK57%improvementfrompopularFR-4configurationto2.2W/mKsolutionNote:thetwoFR-4samplesneededaninsulatorpadbetweentheboardandheatsinkadding0.2ºC/WBergquistTheWorldLeaderInThermalManagementTechnologyComparisonofthermalimpedanceofBergquistMPandHPLdielectric

7、sComponents:LEDGoldenDragon(chip1sqmm)(samewaferLot)MCPCB:Al1,57mmxDielectricx35µmcuResult:ThermalImpedanceZthBergquistMP1.8–2.0K/WBergquistHPL0.8–1.0K/W2ximprovementbyincreasingto3W/mKdielectricfrom1.1W/mKBergquistTheWorldLeaderInThermalManagementTechnologyLightOutputofD

当前文档最多预览五页,下载文档查看全文

此文档下载收益归作者所有

当前文档最多预览五页,下载文档查看全文
温馨提示:
1. 部分包含数学公式或PPT动画的文件,查看预览时可能会显示错乱或异常,文件下载后无此问题,请放心下载。
2. 本文档由用户上传,版权归属用户,天天文库负责整理代发布。如果您对本文档版权有争议请及时联系客服。
3. 下载前请仔细阅读文档内容,确认文档内容符合您的需求后进行下载,若出现内容与标题不符可向本站投诉处理。
4. 下载文档时可能由于网络波动等原因无法下载或下载错误,付费完成后未能成功下载的用户请联系客服处理。
相关文章
更多
相关标签