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时间:2019-03-04
《Bergquist-MCPCBs-and-Thermal-Interface-Material-Considerations-for-High-Power-LED-Lighting-Applications-SanDiego-Oct.2010.pdf》由会员上传分享,免费在线阅读,更多相关内容在学术论文-天天文库。
1、BergquistTheWorldLeaderInThermalManagementTechnologyOSRAMLLFYWORKSHOPOCT28,2010MCPCB’sandThermalInterfaceMaterialConsiderationsforHighPowerLEDLightingApplicationsSteveTaylorSr.FieldApplicationsManagerThermalSubstratesDivisionTheBergquistCompanyAcknowledgements:JustinKolbe–Sr.DevelopmentE
2、ngineer,BergquistCompanySanjayMisra–DirectorofResearch&Development,BergquistCompanyBergquistTheWorldLeaderInThermalManagementTechnologyMCPCB’sandTIMConsiderationsforHighPowerLEDLightingApplicationsOutlineThermalmanagementiskeytoyourdesignThermalperformanceofhighpowerLED’sUnderstanding
3、thermalperformance(referencedata)MCPCBmaterialoptionsandpartgeometryTIMselectionconsiderations,optionsthatareavailableConclusionsBergquistTheWorldLeaderInThermalManagementTechnologyImportanceofThermalManagementofHighPowerLED’sOnly~15-30%ofinputpowerisconvertedtolightTheremaining70-8
4、5%ofinputpowerisconvertedtoheatExcessiveheatcancauseashiftincolorExcessiveheatcanreducelightoutputExcessiveheatcanshortendevicelifeIESNAHandbookOsramSylvaniaSource:PNNL-SA-51901,February2007BergquistTheWorldLeaderInThermalManagementTechnologyModelresultsComparisonofFR-4toIMSGoodtherma
5、lmanagementresultsinlowerjunctiontemperatureBergquistTheWorldLeaderInThermalManagementTechnologyCasestudyresultsThermalimpedanceofOsramDiamondDragononvarioussubstratesThermalResistanceofOsramDiamondDragononVariousSubstrates98765–IllustrationfromOsramDiamondDragonliteratureC/Wo432102layer
6、FR49holes2layerFR418holes1.1W/mK2.2W/mK57%improvementfrompopularFR-4configurationto2.2W/mKsolutionNote:thetwoFR-4samplesneededaninsulatorpadbetweentheboardandheatsinkadding0.2ºC/WBergquistTheWorldLeaderInThermalManagementTechnologyComparisonofthermalimpedanceofBergquistMPandHPLdielectric
7、sComponents:LEDGoldenDragon(chip1sqmm)(samewaferLot)MCPCB:Al1,57mmxDielectricx35µmcuResult:ThermalImpedanceZthBergquistMP1.8–2.0K/WBergquistHPL0.8–1.0K/W2ximprovementbyincreasingto3W/mKdielectricfrom1.1W/mKBergquistTheWorldLeaderInThermalManagementTechnologyLightOutputofD
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