cu的腐蚀与缓蚀的光电化学研究

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1、e44$e11}Vol.44No.112008o11}e1360—1365ACTAMETALLURGICASINICANov.2008pp.1360–1365Cu∗Xr`r[R_~g1)1,2)1)2)1)Æ1)2;h>ylwoU9>y,2;2000902)2;>9>y>,2;200444h1iR?

2、FHCuxqqNaClw_–w/"(?[fY?mnm_(PASP)sCuY?Eh.Cuw_–w/Y<"(,℄Cu2Odp3Ul.SCuf"(
5FNaCl()m0.5g/L)−<,C

3、u℄Cu2Od℄Cl-℄Ul7&;S"(
vNaCl(0.5—15g/L)<,Cu2Od℄−−−ClC-?,Cl-BCu2Od#76n3;S"(
FNaCl(m15g/L)<,Cu2OdCl−-x736n3.Y?mPASPu'm*sCuWY?EhSNaClqq2g/L<,PASPp"(Cl−Cu℄,a℄#HClsCu2Od-,Cu2OWHp3;NaClqq30g/L<,PASPp−−−Clm')ClsCu2Od-,Cu2OdCl-x76n3,n37&).sCu2O

4、d7&Mott–Schottky*8p1iR?8T.ZeCu,1iR?,?,Y?m,nm_yUWj^TG174.4{

5、unA{
^0412−1961(2008)11−1360−06PHOTOELECTROCHEMICALSTUDYOFTHECORRO-SIONANDINHIBITIONONCuXUQunjie1),ZHULu¨jun1,2),QIHang1),CAOWeimin2),ZHOUGuoding1)1)DepartmentofEnergySourceandEnvironmentEngineering,ShanghaiUnivers

6、ityofElectricPower,Shanghai2000902)DepartmentofChemistry,CollegeofScience,ShanghaiUniversity,Shanghai200444Correspondent:XUQunjie,professor,Tel:(021)65430410–247,E-mail:xuqunjie@shiep.edu.cnSupportedbyNationalNaturalScienceFoundationofChina(No.20406009),KeyProjectofShanghaiCommi

7、tteeofScienceandTechnology(No.062312045),KeyProjectofShanghaiEducationCommittee(No.P1304)Manuscriptreceived2008–01–24,inrevisedform2008–07–15ABSTRACTThecorrosionbehaviorsofCuinboraxbuffersolutionwithdifferentconcentrationsofNaClandtheinhibitionofpoly–aspartic(PASP)werestudiedbypho

8、toelectrochemicalmethod.TheCuelectrodeintheboraxbuffersolutionshowsp–typephotoresponsewhichcamefromCu2Olayeronitssurface.WhenalittleamountofNaCl(<0.5g/L)wasadded,theCuOlayerdidn′tchange2itssemiconductorstyle.WhenmoreNaCl(0.5—15g/L)wasadded,apartoftheCu2Olayerwaschangedinton–typeb

9、ecauseofdopingCl−.WhenalargeamountofNaCl(>15g/L)wasadded,theCu2Olayerwastotallychangedinton–type.WhenPASPwasaddedandtheconcentrationofNaClwas2g/L,PASPplayedacompetitiveadsorptionwithCl−andpreventedCuOlayerfrombeing2doped,sotheCu2Olayershowedp–type.WhentheconcentrationofNaClwas30

10、g/L,thecompetitiveadsorptionofPASPonlyprevented