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1、Source:ASICDesignintheSiliconSandboxKeithBarr1TheSandboxAnaloganddigitalcircuitscombinedinanICareconsideredmixed-signaldesigns.Integratingthetwotypesofcircuitrycanbechallenging,butthesedesignscanprovidesystem-on-a-chip(SOC)functionalitythat,oncedesignedintoaproduct,cansignif
2、icantlyimpactfinalproductcost.Asadesignerofcommerciallyviableproducts,alreadybuyingICsfrommajorsuppliers,youcouldapproachamajorICcompanyandsuggestthattheydesignanewcatalogpartforyourapplication;butwithoutsomecostlyagreement,theywouldlikelyoffertheparttoyourcompetitorsaswell,
3、somewhatdullingtheadvantageyoumaybeseeking.YoucancontractanICdesignhousetoproduceadesignforyou,butintheprocessyouwillbetransferringspecificknowledgeofyourbusinesstoothersthatyoumaynotbeabletocompletelycontrol.CommunicationofexactlywhatyouneedisdifficultwithoutknowledgeoftheI
4、Cdesignprocess;it’slikeasalesguytalkingtoanengineer,enoughsaid?Further,thecostofhavingadesignhousedotheworkcaneasilyapproachamilliondollars,evenforafairlysimpledesign.Ifyoudoyourowndesign,youcankeepthedetailsastheintellectualpropertyofyourcompanyandgetexactlywhatyouwant,atlo
5、wercost,withwell-knownreasonsforanytrade-offs.ICOverviewIntegratedcircuitsarefabricatedontosiliconwafers,subsequentlydicedorsawnintoindividualdieandleadbondedontoaleadframe,andthenpackagedwithasurroundingmineral-filledthermosettingpackagingmaterial,orinthecaseofaceramicpacka
6、ge,alidisattached.Dependingondiesizeandwaferdiameter,asfewas10orasmanyas50,000devicescouldresultfromasinglewafer.EveryICyoucurrentlypurchaseandPrintedfromDigitalEngineeringLibrary@McGraw-Hill(www.Digitalengineeringlibrary.com).Copyright©2004TheMcGraw-HillCompanies.Allrightsr
7、eserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.THESANDBOXKeithBarr2useinaproductisproducedinthisway.Ifyoutakeanystandard,plastic-packagedIC,layitupsidedownonapieceof220gritsandpaperandcarefullygrindawaythetopsurface,youwillultimatelybegintoseethegoldbondingwiresap
8、pearandthenthesilicondieitself.Shiftingtofinersandpaper,andcarefullyadjusti
