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1、MicroprocessorsandMicrosystems38(2014)991–999ContentslistsavailableatScienceDirectMicroprocessorsandMicrosystemsjournalhomepage:www.elsevier.com/locate/micproAlowoverhead,faulttolerantandcongestionawareroutingalgorithmfor3Dmesh-basedNetwork-on-ChipsHodaNaghibiJouybari⇑,KarimMohammadiCollegeofElec
2、tricalEngineering,IranUniversityofScienceandTechnology,Tehran,IranarticleinfoabstractArticlehistory:Nowadays,threedimensionalNetwork-On-Chips(NOCs)haveemergedasmostefficientandscalableAvailableonline5October2014communicationstructuresforcomplexandhighperformanceSystem-on-Chips(SOCs).Thesestructure
3、saresosusceptibletomanufacturingandruntimefaults.ThusfaulttolerantroutingisessentialtoincreaseKeywords:reliabilityandperformanceofNOC-basedSOCs.Inthispaper,weproposeFT-DyXYZ,anadaptivefaultThreedimensionalNetwork-on-Chiptolerantroutingtotoleratepermanentfaultylinksin3DmeshbasedNOCsthatusesproximi
4、tyconges-System-on-Chiptioninformationtobalancetraffic.Ourroutingachievesfaulttolerancewithoutusingroutingtables,Faulttolerantroutingredundancyorglobalinformationofpathsandfaults.Toevaluateperformanceofourrouting,wecom-Adaptiveroutingpareditwithfaulttolerantplanar-adaptiveroutingintermsofaveragepa
5、cketlatency,throughputandCongestionreliability.Simulationresultsdemonstratesignificantimprovementofsaturationinjectionrate,averagethroughputandreliabilityofourroutingundersynthetictrafficpatterns.Ó2014ElsevierB.V.Allrightsreserved.1.IntroductionInthispaper,weproposeanadaptiveroutingalgorithmfor3Dme
6、shbasedNOCsthatcantoleratepermanentfaultylinksandusesRecently,threedimensionalintegratedcircuits(3DICs)usingcongestioninformationtobalancenetworkload.Ourproposedstackingofmultipleactivelayersconnectedwithverticalroutinghaslowoverheadbecauseofnoneedtoanyroutingtable,Through-Silicon-Vias(TSVs)haveb
7、eenproposedtoaddresssomeglobalinformationoffaultsandpathsandredundancyofpackets.challengesof2DICs.Thistechnologyprovidesshortinterconnects,Therestofpaperisorganizedasfollows.InSection2relatedperformanceimprovement,powe
