毕业设计--波峰焊接工艺缺陷分析

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1、南京信息职业技术学院毕业设计论文作者学号系部机电学院专业电子组装技术与设备(对口单招)题目波峰焊接的工艺缺陷分析指导教师评阅教师完成时间：年月日毕业设计(论文)中文摘要(题目)：波峰焊接的工艺缺陷分析摘要：波峰焊是指将熔化的软钎焊料（铅锡合金），经电动泵或电磁泵喷流成设计要求的焊料波峰，亦可通过向焊料池注入氮气来形成，使预先装有元器件的印制板通过焊料波峰，实现元器件焊端或引脚与印制板焊盘之间机械与电气连接的软钎焊，也可称为群焊或流动焊。这种焊接方法主要用于传统通孔插装工艺，以及表面组装与通孔插装元器件的混装工艺，适合波峰焊的表面贴装元器件有矩形和圆柱形片式元件、SOT以及

2、较小的SOP器件等。波峰的焊中可能出现的缺陷主要是焊点缺陷、原件缺陷和PCB缺陷。本文通过介绍波峰焊的定义、工艺方式、缺陷分析等，正确引导读者在操作过程中应该注意的部分，提出波峰焊的缺陷并指导读者正确解决波峰焊的缺陷。关键词：波峰焊通孔插装缺陷分析毕业设计(论文)外文摘要Title:WavesolderingdefectsanalysisAbstract:Wavesolderingistopointtowillmeltsoftthesoldering(leadsolderalloy),theelectricpumporelectromagneticpumpsprayflo

3、wintothedesignrequirementsofsolderwave,canalsothroughintothepooltosoldernitrogentoform,inadvanceoftheprintedcircuitboardismadewithcomponentsbysolderwave,realizethepinsorcomponentsweldingandweldingplatemechanicalandPCBelectricalconnectionbetweenthesoftbrazing,canalsobecalledgroupofweldingo

4、rflowwelding.Thiskindofweldingmethodismainlyusedintheholeistraditionalcartridgeprocess,aswellassurfaceassemblyandholecartridgecomponentsofdualprocess,suitableforwavesolderingSMTcomponentsarerectangularandcylindricalchipcomponents,SOTandsmallerSOPdevices,etc.Waveofweldingofthepotentialdefe

5、ctsismainlysolderdefects,theoriginaldefectsandPCBdefects.Thispaperintroducesthedefinition,wavesolderingprocess,processanalysis,defectanalysis,thecorrectguidancereadersinoperationshouldbepaidattentiontoduringthepart,andputsforwardthesolderingdefectandguidethereadercorrectlysolvedthedefects

6、ofsoldering.Keyword:WavesolderingThrough-holeCartridgeDefectsAnalysis目录1引言····························································12波峰焊的基本概念················································12.1波峰焊的分类················································12.2波峰焊机的组成····························

7、··················23波峰焊的工艺····················································23.1波峰焊的工艺方式············································23.2波峰焊接工艺参数设置········································34波峰焊接常见缺陷分析及解决方法··································34.1波峰焊接中常见的缺陷现象···········