固态电容制作流程

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1、CapXonPolymerAlCap技術資料CapxonElectronic(SHENZHEN)Co.Ltd.豐賓電子(深圳)有限公司2009.06.12制作:::汪斌:汪斌华华华1CapXon目录1.1.1.原材料說明1.原材料說明2.2.2.IQC2.IQCIQC檢驗IQC檢驗3.3.3.設計說明3.設計說明444.4...制制制程說明制程說明5.5.5.品質5.品質控控制控制6.6.6.與日系電容比較6.與日系電容比較7.7.7.使用注意事項及應用說明7.使用注意事項及應用說明2CapXo

2、n1.原材料說明固態鋁電容---導電性高分子-導電性高分子,,,原,原原原材料列表如下材料列表如下RADIALTYPEV-CHIPTYPE鋁殼陰極箔電解紙/電解质陽極箔座板導針膠蓋結構材料結構材料陽極箔Aluminumformingfoil導針纯铜镀锡导针陰極箔Carbonfoil膠蓋IIR（100%树脂加硫）Aluminumwithresin/PET/NYLON電解紙RTZ30-40/FNWV30-40鋁殼coatingConductivePolymer電解质座板Nylon/PPS(PEDOT

3、)3CapXon1.1正箔鋁錠
光箔
腐蝕箔
化成箔45CapXon宜昌鋁箔廠R&DCenterProductionofAluminumFoil6CapXonLeadingProductionFacilityPurewaterCoolingtowerPowersupplyForming7CapXonEtchingFoil1.Productionplace：：：SetupetchingandformingfactoryinYi-chang,China,Etching30linesandformin

4、g50lines,becomethebiggestaluminumfoilfactoryofChina.2.Technologysource:WholefactorytechnologytransferfromJapaneseetchingprocessandthencombinedchemicalindustry,electricalmachinery,machinery,automaticallycontrol,environmentalprotectionandmaterialrecycl

5、eengineersinthefactory,setupthestrongR&Dgroup.8CapXonEtchingFoil–SectionofElectronMicroscopePhotoNotevenPiercethroughEvenGoodAltheAlcorecoreOthercompanyCapxonLowcapacitanceandstrengthHighcapacitanceandstrength9CapXonNewTech/Muti-waveEtchingwaveSawtoo

6、thEven,highdensityandwaveExponentcapacitance10CapXonFormingTechnicalHighHydration，highcapacitance，highleakageOrganicacidformingcurrentLowHydration，lowInorganicacidformingcapacitanceLowHydration，highNewformingtechcapacitance，lowleakagecurrentandlongli

7、fe.9%Rateofuse255Vvoltage30%300V520V25%550V600V630V10%8%其它10%8%11CapXonLeakageCurrentComparison250Other)2002formingfoilCapxo150nformingLC(uA/cmfoil1005000102030405060Time(S)12CapXonFormingHighDensityInsulatingLayerThegoodEtchingfoilcharacteristicisd

8、ecidedbytheinsulatinglayerhighdensityandzerodefect.FormingfoilHighdensitylayer13CapXon800倍电子放大镜下观察铝箔表面正箔PS470-16830负箔PS470-1683014CapXon1.2負箔(1)(1)鋁錠(1)鋁錠
光箔
腐蝕箔
极低压化成箔，，，供应商：：：日本：日本JCC/台湾荣成///宜昌凯普松(2)(2)鋁錠(2)鋁錠
光箔
蒸镀纳米炭颗粒（（（供应商（供应商：：：日本：日本TOYAL）））15