贴片电感1608

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1、(1/3)002-02/20040622/e511_mlf1608.fmInductorsMLFSeriesMLF1608TypeForGeneralApplicationsSMDFEATURESPRODUCTIDENTIFICATION•High-reliabilitymonolithicstructure.MLF1608A1R0KT•Ferritecoreandmagneticshieldingenablesthedesignofcom-(1)(2)(3)(4)(5)(6)pactcircuitswithhighpackingdensity.•Excellentsolderab

2、ilityandhighheatresistancepermitseither(1)Seriesnamefloworreflowsoldering.•Theproductscontainnoleadandalsosupportlead-free(2)DimensionsL×Wsoldering.16081.6×0.8mm20122.0×1.25mmAPPLICATIONSDigitalcellularphone,tuner,personalcomputers,audio,orvarious(3)Materialcodeelectronicappliances.(4)Inductan

3、cevalueSPECIFICATIONS47N47nH[0.047µH]R150.15µHOperatingtemperaturerange–25to+85°C1R01µHStoragetemperaturerange–40to+85°C[Unitofproducts]10010µHRECOMMENDEDREFLOWSOLDERINGCONDITIONS(5)InductancetoleranceTemperatureofK±10%PrintedCircuitBoardsurface:250±5˚C10sec.M±20%230±5˚C30sec.10smax.(6)Packagi

4、ngstyle250˚C230˚CNaturalTTaping[reel]cooling16515˚C+_PACKAGINGSTYLEANDQUANTITIESPackagingstyleProduct’sthicknessQuantityTaping0.8/0.85mm4000pieces/reelPreheating60to120smin.30smax.1.25mm2000pieces/reelHANDLINGANDPRECAUTIONSTime(s)•Beforesoldering,besuretopreheatcomponents.Thepreheatingtemperat

5、ureshouldbesetsothatthetempera-turedifferencebetweenthesoldertemperatureandproducttemperaturedoesnotexceed150°C.•Aftermountingcomponentsontotheprintedcircuitboard,donotapplystressthroughboardbendingormishandling.•Theinductancevaluemaychangeduetomagneticsaturationifthecurrentexceedstheratedmaxi

6、mum.•Donotexposetheinductorstostraymagneticfields.•Avoidstaticelectricitydischargeduringhandling.•Whenhandsoldering,applythesolderingirontotheprintedcir-cuitboardonly.Temperatureoftheirontipshouldnotexceed300°C.Solderingtimeshouldnotexceed3seconds.•Allspecificationsaresubjecttochangewithoutnot

7、ice.(2/3)002-02/20040622/e511_mlf1608.fmInductorsMLFSeriesMLF1608TypeForGeneralApplicationsSMDSHAPESANDDIMENSIONS/RECOMMENDEDPCBOARDPATTERN1.6±0.150.70.150.7±2.10.83±0.20.15±0.8Weight:4mgDimensionsinmmELECTRICALCHARACTERISTICSTestSelf-r