PCB Design Guidelines For Reduced EMI英文文献资料

PCB Design Guidelines For Reduced EMI英文文献资料

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1、PCBDesignGuidelinesForReducedEMISZZA009November19991IMPORTANTNOTICETexasInstrumentsanditssubsidiaries(TI)reservetherighttomakechangestotheirproductsortodiscontinueanyproductorservicewithoutnotice,andadvisecustomerstoobtainthelatestversionofrelevantinformationtoverify,beforeplacing

2、orders,thatinformationbeingreliedoniscurrentandcomplete.Allproductsaresoldsubjecttothetermsandconditionsofsalesuppliedatthetimeoforderacknowledgement,includingthosepertainingtowarranty,patentinfringement,andlimitationofliability.TIwarrantsperformanceofitssemiconductorproductstothe

3、specificationsapplicableatthetimeofsaleinaccordancewithTI’sstandardwarranty.TestingandotherqualitycontroltechniquesareutilizedtotheextentTIdeemsnecessarytosupportthiswarranty.Specifictestingofallparametersofeachdeviceisnotnecessarilyperformed,exceptthosemandatedbygovernmentrequire

4、ments.CERTAINAPPLICATIONSUSINGSEMICONDUCTORPRODUCTSMAYINVOLVEPOTENTIALRISKSOFDEATH,PERSONALINJURY,ORSEVEREPROPERTYORENVIRONMENTALDAMAGE(“CRITICALAPPLICATIONS”).TISEMICONDUCTORPRODUCTSARENOTDESIGNED,AUTHORIZED,ORWARRANTEDTOBESUITABLEFORUSEINLIFE-SUPPORTDEVICESORSYSTEMSOROTHERCRITIC

5、ALAPPLICATIONS.INCLUSIONOFTIPRODUCTSINSUCHAPPLICATIONSISUNDERSTOODTOBEFULLYATTHECUSTOMER’SRISK.Inordertominimizerisksassociatedwiththecustomer’sapplications,adequatedesignandoperatingsafeguardsmustbeprovidedbythecustomertominimizeinherentorproceduralhazards.TIassumesnoliabilityfor

6、applicationsassistanceorcustomerproductdesign.TIdoesnotwarrantorrepresentthatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orotherintellectualpropertyrightofTIcoveringorrelatingtoanycombination,machine,orprocessinwhichsuchsemiconductorprodu

7、ctsorservicesmightbeorareused.TI’spublicationofinformationregardinganythirdparty’sproductsorservicesdoesnotconstituteTI’sapproval,warrantyorendorsementthereof.Copyrightã1999,TexasInstrumentsIncorporated2ContentsTitlePageABSTRACT.....................................................

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