PCB工程资料中常见的英文缩写汇总

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1、工程图档资料中常见的英文缩写汇总08/06/2009工程圖檔資料中常見的英文縮寫匯總¾AOI:AutomaticOpticalInspection自動光學檢測¾SMD:SurfaceMountDevices表面安裝設備¾SMB:SurfaceMountBoard表面安裝板¾SMT:SurfaceMountTechnology表面安裝技術¾MIL:MilitaryStandard美國軍用標准¾LPI:LiquidPhotoImageableSolderMask液態感光阻焊油¾SMOBC:SolderMaskOnBareCopper裸銅覆蓋阻焊工藝¾OSP:OrganicSoldera

2、bilityPreservative焊錫性有機保護劑¾PTI:ProofTrackingIndex耐電壓起痕指數¾CTI:ComparativeTrackingIndex相對漏電起痕指數¾HASL:HotAirSolderLeveling噴錫HAL:HotAirLeveling噴錫¾PCB:PrintedCircuitBoard印制電路板¾PWB:PrintedWiringBoard印制線路板¾CCL:Copper-cludlaminat覆銅箔層壓板¾FPC：Flexibleprintedboard柔性线路板简称，又称软板¾CAD:ComputerAidedDesign計算機輔助設

3、計¾CAM:ComputerAidedManufacturing計算機輔助制造¾CAT:ComputerAidedTesting計算機輔助測試¾PTH:PlatedThroughHole鍍通孔¾IC:IntegratedCircuit集成線路¾UL:UnderWritersLaboratories美國保險商實驗室¾CNS:ChineseNationalStandards中國國家標准¾BGA:BallGridArray球柵陣列¾BUM:Build-upMultilayer積層法多層板¾CFR:CodeofFederalRegularations聯邦法規全書¾AQL:Acceptabl

4、eQualityLevel允收品質水准¾LDI:LaserDirectImaging鐳射直接成像¾HDI:HighDensityInterconnection–-Build-upMultilayer高密度互連積層多層板制作：危志强2009/7/152:06:24PM1/34工程图档资料中常见的英文缩写汇总08/06/20091.依照標准(inaccordingwithrelatedstandards)：IPC:TheInstituteforInternationalandPackagingElectronicCircuit美國電路互連與安裝學NEMA:NationalElectro

5、nicManufacturingAssociation國家電子制造協會/美國電氣制造協會2.基本材料(basematerial)：naturalcolor自然色externalcopperweight外層銅厚copperclad覆銅箔prepreg預浸材料（指半固化膠片）Tgrating玻璃化溫度laminate基板cross-section切片cutout切口Metalcore金屬芯typeofboard板類(singlesided單面doublesided雙面multilayer多層)epoxyglassfiber環氧玻璃纖維flammabilityrating/class防火

6、等級dielectricmaterial介質材料temperature溫度ResinContent膠含量GlassTransitionTemperature(由”玻璃态”转化为”橡皮态”简称为TG!)basecopper(基銅)3.偏差及公差(deviation&tolerance):registration對位(重合度)dimension(長/寬/高)尺寸大小radius&diameter半徑/直徑holesize/aperture孔徑width寬度length長度depth深度height高度thickness厚度spacing間距axis軸coordinate坐標parame

7、ter參數copperfoil銅箔boardoutline/contour板輪廓圖edgetoedge邊到邊heatsinkplane散熱層stackup疊層$疊放finish(ed)thickness完成厚度trace=track=line=pattern=conductor＝rail=circuit線路toplayer上層&bottomlayer下層layertolayerregistration層與層對位interlayer&externallayer內層&外層