Industrial Cyber-Physical Systems – iCyPhy

Industrial Cyber-Physical Systems – iCyPhy

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时间:2019-07-31

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1、IndustrialCyber-PhysicalSystemsiCyPhyAmitFisher,ClasA.Jacobson,EdwardA.Lee,RichardM.Murray,AlbertoSangiovanni-Vincentelli,andEelcoScholteAbstract.ICyPhyisapre-competitiveindustry-academicpartnershipfocusedonarchitectures,abstractions,technologies,methodologies,andsupportingtoolsforthedesign,modeli

2、ng,andanalysisoflarge-scalecomplexsystems.Thepurposeofthispartnershipistopromoteresearchthatappliesbroadlyacrossindustries,providingtheintellectualfoundationfornextgenerationsystemsengineering.Thefocusisoncyber-physicalsystems,whichcombineacyberside(computingandnet-working)withaphysicalside(e.g.,m

3、echanical,electrical,andchemicalprocesses).Suchsystemspresentthebiggestchallengesandbiggestopportunitiesinseveralcriticalindustrialsegmentssuchaselectronics,energy,automotive,defenseandaerospace,telecommunications,instrumentation,andindustrialautomation.Theap-proachleveragesconsiderableexperienced

4、esigningcomplexartifactsinthesemi-conductor,embeddedsystems,andsoftwareindustries,andmajorrecentadvancesinalgorithmictechniquesfordealingwithcomplexity.Thisconsortiumadaptsandextendsthesetechniquestohandlethefundamentallydifferentchallengesinlarge-scalecyber-physicalsystems.AmitFisherIBM,Sunnyvale

5、,CA,USAe-mail:amitf@il.ibm.comClasA.JacobsonUTRC,EastHartford,CT,USAe-mail:jacobsCA@utrc.utc.comEdwardA.Lee·AlbertoSangiovanni-VincentelliUCBerkeley,Berkeley,CA,USAe-mail:{eal,alberto}@eecs.berkeley.eduRichardM.MurrayCaliforniaInstituteofTechnology,Pasadena,CA,USAe-mail:murray@cds.caltech.eduEelco

6、ScholteUTCAerospaceSystems,WindsorLocks,CT,USAe-mail:Eelco.Scholte@utas.utc.comM.Aiguieretal.(eds.),ComplexSystemsDesign&Management2013,21DOI:10.1007/978-3-319-02812-5_2,cSpringerInternationalPublishingSwitzerland201422A.Fisheretal.1IndustrialMotivationEfficientandeffectivedesignofdistributedmulti

7、-scalecomplexsystemsislargelyanunsolvedproblem.Complexsystemsarecompositionsofheterogeneouscompo-nents,whichforcyber-physicalsystemsoftenincludeelectromechanical,chemical,thermal,computing,andcommunicationelement

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