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1、ICRMS2014CoverPageTitle:ThermalCouplingEffectsandThermalResistanceMatrixResearchofMulti-HeatSourcesMCMAuthors:JiCheng、,XiaoqiHe^HengweiBao,XunpingLi^BinZhou,LianrongZhou,ZhangchaoWangAuthorsName(ofAffiliation:DepartmentName,NameofOrganization,City,Country)'
2、SchoolofMaterialsandEnergy,GuangdongUniversityofTechnology,Guangzhou,China2ScienceandTechnologyonReliabilityPhysicsandApplicationofElectronicComponentLaboratoiy,Guangzhou,China‘EastChinaResearchInstituteofMicroelectronic,Hefei,ChinaCorrespondingauthor:Corre
3、spondingauthorname:JiCheng,XiaoqiHe,E-mail:ccchengii@yeah.net.hxq@ceprei.com.Phone:15622303006,020-87237897Abstract:HighdensityassemblyresultsinevidentthermalcouplingeffectbetweenchipsinMCM.Junctiontemperatureisdecidedbyself heatingeffectandthermalcouplinge
4、ffect.Itcanbeeffectivelycalculatedbythethermalresistancematrix.ThispaperfocusesonthermalcouplingeffectandpresentsheatconductionroutesandthermalresistancemodelofthreedifferentMCM(lateral-chip,stacked-chipandlateral-and-stackedchip).Basedonlinearsuperposition
5、theory,thethermalresistancematrixisestablishedbyFEAsimulation,andthemodelofcalculatingjunctiontemperatureisobtainedbythennalresistancematrix.Thenthemodelisverifiedbyinfraredthermalimagingexperiment.Therelativeerrorbetweenthemislessthan2%Category:Design,Test
6、andAssessmentforReliability,Reliabilitysimulationtechnology(19)Presentationmode:posterThermalCouplingEffectsandThermalResistanceMatrixResearchofMulti-HeatSourcesMCMJiChengl,2a,XiaoqiHelb,XunpingLi1,BinZhou1'ScienceandTechnologyonReliabilityPhysicsandApplica
7、tionofElectronicComponentLaboratory,Guangzhou,China2SchoolofMaterialsandEnergy,GuangdongUniversityofTechnology,Guangzhou,Chinaaccchengii@ycah.n比bhxq@ceDrci.comHengweiBao3,LianrongZhouZhangchaoWang3‘EastChinaResearchInstituteofMicroelectronic,Hefei,ChinaAbs
8、tract—HighdensityassemblyresultsinevidentthermalcouplingeffectbetweenchipsinMCM.Junctiontemperatureisdecidedbyself-heatingeffectandthermalcouplingeffect.Itcanbeeffectivelycalculatedbythethermalresistan
