PCB制作简介2.ppt

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1、Part1IntroductionofPCB线路板简介Part2Manufacturingofouterlayer外层制作Part3Manufacturingofouterlayer内层制作Part4SpecialRequirement特别要求SUMMARY内容概述第一部分线路板简介喷锡板镀金板沉金板单面板双面板多层板硬板软板软硬板明孔板暗孔板盲孔板碳油板金手指板ENTEK板Hardness硬度PCBTypesPCB分类HoleDepth孔的导通状态FabricationandCustomerRequirement

2、s生产及客户的要求Structure结构SketchMapsClassifiedbyLayerNumber依板的层数分类Doublesidedwithrivet双面板Singlesided单面板MultilayerwithPTH多层板（PTH）DoublesidedwithPTH双面板（PTH）Pressing压板时Drilling钻孔后PTH沉铜后Connectorofinterlayer层间线路连接件第二部分外层制作PrepregManufacturingP片制作GlassFabricCloth玻璃纤维布Raw

3、Material原材料EpoxyResin环氧树脂Activator催化剂Hardener硬化剂DrippingTreating含浸处理Half-HardenPrepreg半固化树脂片Store,Cooling,keep入仓保存LaminateFabrication层压板制作TypeofPrepregP片型号举例：MaterialformShanghai原料供应为上海AS76284U44518T1ProducedinAlineA拉生产Proxytype玻璃布型号Resin84218421树脂Representing

4、theyear1999代表1999年44%ofEpoxy环氧树脂含量为44%Producingmonth生产月份Productiontypeforcurrentdate当天生产卷号Representingthedate20代表20号DirectionNo.1一号配方1.BoardCutting开料Al铝Baseboard(底板,可分为木质板和酚醛板)Al铝:ScatterHeat散热CupperFoil铜膜:SupplyConductorlayer提供导电层BaseBoard底板:AvoidBitDamage:防钻

5、头受损ThreeTypesofBoardDimension三种尺寸的板料：36“×48”;48“×48”;42"×48"CopperFoil铜膜Laminate板料Profiling外形加工Punching啤圆角Grinding磨板边Mark打字唛Nailing钉板3P20116A0ManufacturedbyD3生产厂为D3厂.Productionboard生产板Double-sidedboard双面板Serialnumberofdouble-sidedboard双面板的编号Versionnumber版本号Pro

6、ductionNo.生产型号举例：2.Drilling钻孔DrilledBoardSection钻孔板的剖面图Drilling钻孔Orientationhole定位孔Hole孔Prepreg板料Al铝DrillingTool钻孔工具Bit钻头Motor马达TopPanelHoleLocationXDeviation(0.001"Increments)YDeviation(0.001"Increments)Position位置DrillingMachine钻床FinishedPCBProductPCB成品WetFil

7、m绿油Annualring锡圈V-CutV坑ScreenMarks白字PAD焊锡盘ProductionNumber生产型号3C6013C6013C6013P20116A0GoldenFinger金手指（1）GⅡ黄菲林(线路菲林）（2）W/MFilm绿油菲林（3）C/MFilm白字菲林3P20116A03C6013C6013C6013C601O/Lfilms外层菲林3.PTH/PanelPlating沉铜/板面电镀PanelPlating板面电镀PTH孔内沉铜PTH孔内沉铜PanelPlating板面电镀Prepre

8、g板料CutawayofPanelPlatingandCopperImmersion沉铜/板面电镀剖面图PTH/PPMicro-section沉铜/板面电镀微切片Basecopper基铜Electrolesscopper无电沉铜PanelPlatingCopper板面电镀铜4.DryFilm干菲林WIPSectionofPre-exposure曝光前半成品分