电路板制作流程说课材料.ppt

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1、电路板制作流程顧客CUSTOMER裁板LAMINATESHEAR業務SALESDEP.生產管理P&MCONTROLMASTERA/W底片DISK,M/T磁片磁帶藍圖DRAWING資料傳送MODEM,FTP網版製作STENCILDRAWING圖面RUNCARD製作規範PROGRAM程式帶鑽孔,成型機D.N.C.工程製前FRONT-ENDDEP.工作底片WORKINGA/W(1)Front-endProcess(Tooling)1(2)多層板內層製作流程曝光EXPOSURE壓膜LAMINATION前處理PRELIMINARYTREATMENT去膜STRIPPING蝕銅

2、ETCHING顯影DEVELOPING黑化處理BLACKOXIDE烘烤BAKINGLAY-UP預疊板及疊板後處理POSTTREATMENT壓合LAMINATION內層乾膜INNERLAYERIMAGE預疊板及疊板LAY-UP蝕銅I/LETCHING鑽孔DRILLING壓合LAMINATION多層板內層流程INNERLAYERPRODUCTMLBAOI檢查AOIINSPECTION裁板LAMINATESHEARDOUBLESIDE雷射鑽孔LASERABLATIONBlindedVia裁板初裁破靶捞边2通孔電鍍P.T.H.鑽孔DRILLING外層乾膜OUTERLAYE

3、RIMAGE二次銅及錫鉛電鍍PATTERNPLATING檢查INSPECTION前處理PRELIMINARYTREATMENT二次銅電鍍PATTERNPLATING蝕銅ETCHING全板電鍍PANELPLATING外層製作OUTER-LAYERO/LETCHING蝕銅TENTINGPROCESSDESMER除膠渣E-LESSCU通孔電鍍前處理PRELIMINARYTREATMENT剝錫鉛T/LSTRIPPING去膜STRIPPING壓膜LAMINATION錫鉛電鍍T/LPLATING曝光EXPOSURE(3)OuterLayerProcessFlow顯影DEVEL

4、OPING3液態防焊LIQUIDS/M外觀檢查VISUALINSPECTION成型FINALSHAPING檢查INSPECTION電測ELECTRICALTEST出貨前檢查OQC包裝出貨PACKING&SHIPPING塗佈印刷S/MCOATING前處理PRELIMINARYTREATMENT曝光EXPOSUREDEVELOPING顯影POSTCURE後烘烤預乾燥PRE-CURE噴錫HOTAIRLEVELING銅面防氧化處理OSP(EntekCu106A)HOTAIRLEVELINGG/FPLATING鍍金手指鍍化學鎳金E-lessNi/AuForO.S.P.印文字

5、SCREENLEGEND選擇性鍍鎳鍍金SELECTIVEGOLD(4)SurfaceFinished&FinalInspection全面鍍鎳金GOLDPLATING4TypicalPCBManufacturingProcess1.（基板）THINCORE2.（压膜）DryFilmResistCoatEtchPhotoresist(D/F)LaminateCopperFoil5TypicalPCBManufacturingProcess4.（显影）Develop3.（曝光）ExposeA/W(PhotoTools)6TypicalPCBManufacturingPr

6、ocess5.（蚀刻）Etch6.（剥膜）StripResist7TypicalPCBManufacturingProcess7.（叠合）Lay-up8.（压合）LaminationLAYER2LAYER3LAYER4LAYER5LAYER1LAYER68TypicalPCBManufacturingProcess9.（钻孔）Drilling(Primary)10.（PTH&镀铜）PTH&CopperDeposition9TypicalPCBManufacturingProcess11.（外层压膜）DryFilmLamination(Outerlayer)12.（

7、曝光）Expose10TypicalPCBManufacturingProcess13.（显影）Develop14.（镀二铜）PatternPlating11TypicalPCBManufacturingProcess15.（镀锡铅）TinPlating16.（剥膜）FilmStripping12TypicalPCBManufacturingProcess15.（蚀刻）Etch16.（剥锡铅）TinStripping13TypicalPCBManufacturingProcess18.（表面处理）SurfaceFinished(ElectrolessNi/Au,H

8、AL……)