IC工艺几种IC工艺流程.ppt

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1、第五单元：集成技术简介第十二章：几种IC工艺流程12.1.CMOS工艺Afterstudyingthematerialinthischapter,youwillbeableto:Drawadiagramshowinghowatypicalwaferflowsinasub-micronCMOSICfab.画出典型的流程图Giveanoverviewofthesixmajorprocessareasandthesort/testareainthewaferfab.对6种主要工艺的应用和测试有大概的认识Foreachofthe14CMOSmanufacturingsteps,describe

2、itsprimarypurpose.描述CMOS工艺14个步骤的主要目的DiscussthekeyprocessandequipmentusedineachCMOSmanufacturingstep.能讨论每一步流程的关键工艺和设备MajorFabricationStepsinMOSProcessFlowOxidation(Fieldoxide)SiliconsubstrateSilicondioxideoxygenPhotoresistDevelopoxidePhotoresistCoatingphotoresistMask-WaferAlignmentandExposureMask

3、UVlightExposedPhotoresistexposedphotoresistGSDActiveRegionstopnitrideSDGsiliconnitrideNitrideDepositionContactholesSDGContactEtchIonImplantationresistoxDGScanningionbeamSMetalDepositionandEtchdrainSDGMetalcontactsPolysiliconDepositionpolysiliconSilanegasDopantgasOxidation(Gateoxide)gateoxideoxyg

4、enPhotoresistStripoxideRFPowerIonizedoxygengasOxideEtchphotoresistoxideRFPowerIonizedCF4gasPolysiliconMaskandEtchRFPoweroxideIonizedCCl4gaspolygateRFPowerCMOSProcessFlowOverviewofAreasinaWaferFabDiffusionPhotolithographyEtchIonImplantThinFilmsPolishModelofTypicalWaferFlowinaSub-MicronCMOSICFabT

5、est/SortImplantDiffusionEtchPolishPhotoCompletedWaferUnpatternedWaferWaferStartThinFilmsWaferFabrication(front-end)SimplifiedSchematicofHigh-TemperatureFurnaceGasflowcontrollerTemperaturecontrollerPressurecontrollerHeater1Heater2Heater3ExhaustProcessgasQuartztubeThree-zoneHeatingElementsTemperat

6、ure-settingvoltagesThermocouplemeasurementsPhotolithographyBayinaSub-micronWaferFabLoadStationVaporPrimeSoftBakeCoolPlateCoolPlateHardBakeTransferStationResistCoatDevelop-RinseEdge-BeadRemovalWaferTransferSystemWaferCassettesWaferStepper(Alignment/ExposureSystem)SimplifiedSchematicofaPhotolithog

7、raphyProcessingModuleSimplifiedSchematicofDryPlasmaEtchere-e-R+Glowdischarge(plasma)GasdistributionbaffleHigh-frequencyenergyFlowofbyproductsandprocessgasesAnodeelectrodeElectromagneticfieldFreeelectronIonsheathChamberwallP