artech.house.an.introduction.to.microelectromechanical.systems.engineering.2nd.edition.ebooklib外语英文电子书

artech.house.an.introduction.to.microelectromechanical.systems.engineering.2nd.edition.ebooklib外语英文电子书

ID:8013255

大小:4.28 MB

页数:305页

时间:2018-03-04

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1、AnIntroductiontoMicroelectromechanicalSystemsEngineeringSecondEditionForalistingofrecenttitlesintheArtechHouseMicroelectromechanicalSystems(MEMS)Series,turntothebackofthisbook.AnIntroductiontoMicroelectromechanicalSystemsEngineeringSecondEditionNadimMal

2、ufKirtWilliamsArtechHouse,Inc.Boston•Londonwww.artechhouse.comLibraryofCongressCataloging-in-PublicationDataAcatalogrecordforthisbookisavailablefromtheU.S.LibraryofCongress.BritishLibraryCataloguinginPublicationDataMaluf,Nadim.AnIntroductiontomicroelect

3、romechanicalsystemsengineering–2nded.–(ArtechHousemicroelectromechanicallibrary)1.MicroelectromechanicalsystemsI.TitleII.Williams,Kirt621.3’81ISBN1-58053-590-9CoverdesignbyIgorValdman©2004ARTECHHOUSE,INC.685CantonStreetNorwood,MA02062Allrightsreserved.P

4、rintedandboundintheUnitedStatesofAmerica.Nopartofthisbookmaybereproducedorutilizedinanyformorbyanymeans,electronicormechanical,includ-ingphotocopying,recording,orbyanyinformationstorageandretrievalsystem,withoutpermissioninwritingfromthepublisher.Allter

5、msmentionedinthisbookthatareknowntobetrademarksorservicemarkshavebeenappropriatelycapitalized.ArtechHousecannotattesttotheaccuracyofthisinforma-tion.Useofaterminthisbookshouldnotberegardedasaffectingthevalidityofanytrade-markorservicemark.InternationalS

6、tandardBookNumber:1-58053-590-910987654321ToourfamiliesTanya,Ella,andJadErika,Gordon,Brynn,andReed.ContentsForewordxiiiPrefacexvPrefacetoFirstEditionxixCHAPTER1MEMS:ATechnologyfromLilliput1ThePromiseofTechnology1WhatAreMEMS—orMST?2WhatIsMicromachining?3

7、ApplicationsandMarkets4ToMEMSorNotToMEMS?7Standards8ThePsychologicalBarrier8Journals,Conferences,andWebSites9ListofJournalsandMagazines9ListofConferencesandMeetings10Summary11References11SelectedBibliography12CHAPTER2MaterialsforMEMS13Silicon-Compatible

8、MaterialSystem13Silicon13SiliconOxideandNitride19ThinMetalFilms20Polymers21OtherMaterialsandSubstrates21GlassandFusedQuartzSubstrates21SiliconCarbideandDiamond22GalliumArsenideandOtherGroupIII-VCompoundSemiconductors22Polymers23S

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