智能电脑散热系统设计报告

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1、西华大学电气信息学院智能化电子系统设计报告目录1、前言··································································12、总体方案设计·························································22.1设计内容··························································22.2方案比较·····································

2、·····················22.3方案论证··························································32.4方案选择··························································33、单元模块电路简介与设计················································43.1本系统部分器件介绍··········································

3、······43.1.1DS18B20温度传感器简介··········································43.1.2STC89C52RC单片机简介···········································43.1.3ULN2003芯片简介第31页西华大学电气信息学院智能化电子系统设计报告···············································53.2单元模块电路设计·····································

4、·············63.2.1电源电路·····················································63.2.2单片机主芯片电路··············································73.2.3时钟电路·····················································73.2.4复位电路·····················································83.2.5显示

5、电路······················································83.2.6温度检测电路··················································93.2.7按键控制电路··················································93.2.8报警及电机电路················································93.3模块连接总电路··················

6、·································104、软件设计·····························································11第31页西华大学电气信息学院智能化电子系统设计报告4.1程序设计原理及所用工具········································114.2主程序设计····················································114.3主要模块主程序设计···········

7、·································125、系统调试·····························································156、系统功能、指标参数···················································187、结论·································································198、总结与体会························

8、···································209、参考文献······························································21附录1