研发，价值链定位与全球电子产业的企业绩效[外文翻译]

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1、本科毕业论文（设计）外文翻译原文：R&D,ValueChainLocationandFirmPerformanceintheGlobalElectronicsIndustryIntoday’sglobalelectronicsindustry,innovationiscarriedoutbyvariousvaluechainparticipants,includingbrand-namemanufacturers(sometimescalledleadfirms),contractmanufacturersandcomponentsuppliers,

2、butthereislittleunderstandingofwhobenefitsmostfrominnovationinsuchnetworks.ThisresearchexaminesempiricallytherelationshipofR&Dspendingandlocationinthevaluechain(leadvs.non-leadfirms)tofirmperformanceintheglobalelectronicsindustrybyusingtheElectronicBusiness300datasetfor2000–200

3、5.OurresultsshowthatfirmsspendingmoreonR&Dhavehighergrossprofits,butdonothavehigherreturnonequity(ROE)andreturnonassets(ROA).Thereisastrongpositiverelationshipbetweenleadfirmsandperformanceasmeasuredbygrossprofit,ROEandROA,buttherelationshipbetweenleadfirmsandgrossprofitbecomes

4、insignificantwhentheinteractiontermofR&Dandleadfirmisincludedintheanalysis.Finally,leadfirmstatushasapositiveinteractioneffectontherelationshipbetweenR&Dandgrossprofit.ThesefindingssuggestthattherelationshipofR&Dtoperformanceismixed,butthatleadfirmscancapturehighervalue(grosspr

5、ofit)fromR&Dthancontractmanufacturersandcomponentsuppliers.Intoday’sglobaleconomy,outsourcinghasbecomeastrategicnecessity,especiallyinfiercelycompetitiveandrapidlychangingsectorssuchaselectronics.Valuechainsintheelectronicsindustryhavesteadilydisintegratedacrosscorporateandnati

6、onalboundariesforthepastseveraldecades.AccordingtoBaldwinandClark(2006),theelectronicsindustryhasevolvedtoamodularstructureinwhichfirmskeepasmallersetofactivitiesin-house(asmallerfootprint)byoutsourcingthefunctionsthatdonotconstrainoverallbusinessperformance.Inthepast,largeelec

7、tronicsfirmsdesignedanddevelopedtheirownproducts,oftenusingtheirinternalsupplychains(Lindenetal.,2007).Today,leadfirms(brand-namemanufacturers)focusoncorecompetencies,especiallyproductinnovation,marketingandotheractivitiesrelatedtobranddevelopment,whileusingspecializedsuppliers

8、fornon-corefunctionssuchasmanufacturing(Sturgeon,2002;