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1、Source:ASICDesignintheSiliconSandboxKeithBarr1TheSandboxAnaloganddigitalcircuitscombinedinanICareconsideredmixed-signaldesigns.Integratingthetwotypesofcircuitrycanbechallenging,butthesedesignscanprovidesystem-on-a-chip(SOC)functionalitythat,oncedesignedintoaproduct,cansignificantlyimpactfinalpro
2、ductcost.Asadesignerofcommerciallyviableproducts,alreadybuyingICsfrommajorsuppliers,youcouldapproachamajorICcompanyandsuggestthattheydesignanewcatalogpartforyourapplication;butwithoutsomecostlyagreement,theywouldlikelyoffertheparttoyourcompetitorsaswell,somewhatdullingtheadvantageyoumaybeseeking
3、.YoucancontractanICdesignhousetoproduceadesignforyou,butintheprocessyouwillbetransferringspecificknowledgeofyourbusinesstoothersthatyoumaynotbeabletocompletelycontrol.CommunicationofexactlywhatyouneedisdifficultwithoutknowledgeoftheICdesignprocess;it’slikeasalesguytalkingtoanengineer,enoughsaid?
4、Further,thecostofhavingadesignhousedotheworkcaneasilyapproachamilliondollars,evenforafairlysimpledesign.Ifyoudoyourowndesign,youcankeepthedetailsastheintellectualpropertyofyourcompanyandgetexactlywhatyouwant,atlowercost,withwell-knownreasonsforanytrade-offs.ICOverviewIntegratedcircuitsarefabrica
5、tedontosiliconwafers,subsequentlydicedorsawnintoindividualdieandleadbondedontoaleadframe,andthenpackagedwithasurroundingmineral-filledthermosettingpackagingmaterial,orinthecaseofaceramicpackage,alidisattached.Dependingondiesizeandwaferdiameter,asfewas10orasmanyas50,000devicescouldresultfromasing
6、lewafer.EveryICyoucurrentlypurchaseandPrintedfromDigitalEngineeringLibrary@McGraw-Hill(www.Digitalengineeringlibrary.com).Copyright©2004TheMcGraw-HillCompanies.Allrightsreserved.AnyuseissubjecttotheTermsofUseasgivenatthewebsite.THESANDBOXKeithBarr2useinaproductisproducedinthisway.Ifyoutakeanysta
7、ndard,plastic-packagedIC,layitupsidedownonapieceof220gritsandpaperandcarefullygrindawaythetopsurface,youwillultimatelybegintoseethegoldbondingwiresappearandthenthesilicondieitself.Shiftingtofinersandpaper,andcarefullyadjusti