杜邦电镀干膜资料

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1、PrintedCircuitMaterialsRiston®PM300技术说明书和制程介绍适用于镀铜，锡，锡铅的精细线路干膜PRODUCTFEATURES/APPLICATIONSPRODUCTDESCRIPTION产品描述产品特性/运用(PhysicalParameters物性数据)•Negativeworking,aqueousprocessabledryAvailableThickness:PM33030µmfilmphotoresist可选厚度PM33838µm负性工作，水溶性光阻PM35

2、050µm•DesignatedforsuperfinelinepatternplatingUnexposedColorinYellowLight:Greenapplication.黄光下未曝光光阻颜色：绿色ExposedColorinDaylight:Blue适用于曝光–酸性蚀刻制程•Featuredinwideplatinglatitudethatcanbe日光下已曝光光阻颜色：蓝色ExposedColorinYellowlight:Greenprocessedatdifferentplati

3、ngconditionwithoutunderplating.黄光下已曝光光阻颜色：绿色Print-Out(Phototropic)Image:Strong宽广的电镀窗口，适于各种电镀条件而无渗曝光后图形颜色反差：强烈镀现象ContrasttoCopper:Strong•Strippingflakesizeis3mmwhichcanbe与铜面反差：强烈easilyseparatedwhenoverplated.Odor:Low褪膜碎片尺寸约3mm，即使镀层过厚也能轻气味：小易褪净•Vividpri

4、ntoutimageafterexposureforeastinspection.SAFEHANDLING安全操作曝光后变色明显，易于检查Notesafetyandindustrialhygiene•Availablein30,38and50micronthicknessprecautions.ConsulttheMaterialSafetyDatadependonplatingthickness.Sheet(MSDS)ofanychemicalused.®根据镀层厚度要求，有30,38,及50微

5、米膜厚MSDS’sforRistondryfilmphotoresistsareavailable.供选择注意安全和工业卫生规范。参考MSDS。SRiston®光阻MSDS备索。TORAGE储存Temperature温度:5-21°C(40-70°F)RelativeHumidity湿度:30-70%®ThisDataSheetdocumentsspecificprocessinformationforRistonPM300.For®morebackgroundongeneralRistonpro

6、cessingseetheGeneralProcessingGuide.本技术说明书为Riston®PM300的专用制程信息。如需Riston®更多资料，请参阅综合制程指导。Page1PM300datasheet07/2007PrintedCircuitMaterialsCOPPERSURFACESANDSURFACECHEMICALLYCLEANEDCOPPERPREPARATION化学清洗铜面®AlkalineSprayCleaner(e.g.VersaCLEAN铜面状态及表面处理415)fo

7、rremovaloforganiccontaminantsfollowedbyaspraymicroetchant(e.g.Toremoveantitarnish,conversioncoatingsSureETCH®550)forconversioncoatingand/oroxidation,itisrecommendedto(chromate)and/orcopperoxideremovalprecedepumice,aluminumoxide,acid(about2-2.5µm;80-10

8、0microinchetch).Acleaner,sulfuricacidormicroetch.10%sulfuricacidspraymaybeusedbetween为去除防锈层或氧化，建议用进行浮石alkalinecleanerandmicroetchanttohelpwiththeconversioncoatingremoval.Inthiscase粉、氧化铝、酸洗，硫酸或微蚀处理。only1.5µm(60microinch)microetchdepthisrequired