1、SMT回流焊工艺词汇1. Fundamentals of Solders and Soldering(焊料及焊接基础知识)Soldering Theory(焊接理论)Microstructure and Soldering(显微结构及焊接)Effect of Elemental Constituents on Wetting(焊料成分对润湿的影响)Effect of Impurities on Soldering(杂质对焊接的影响)2. Solder Paste Technology(焊膏工艺)
3、aste Release From Squeegee(锡膏脱离刮刀问题)Smear(印锡模糊) Insufficiency(印锡不足)Needle Clogging(针孔堵塞)Slump(塌落)Low Tack(低粘性) Short Tack Time (粘性时间短)4. SMT Problems Occurred During Reflow(回流过程中的SMT问题)Cold Joints(冷焊) Nonwetting(不润湿)Dewetting(反润湿) Leaching(浸析)Interme
4、tallics(金属互化物) Tombstoning(立碑)Skewing(歪斜) Wicking(焊料上吸)Bridging(桥连)Voiding(空洞)Opening(开路) Solder Balling(锡球)Solder Beading(锡珠) Spattering(飞溅)5. SMT Problems Occurred at Post Reflow Stage(回流后问题)White Residue(白色残留物) Charred Residue(炭化残留物)Poor Probing C
5、ontact(探针测接问题)Surface Insulation Resistance or Electrochemical Migration Failure(表面绝缘阻抗或电化迁移缺陷)Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants(分层 / 空洞 / 敷形涂覆或包封的固化问题)6. Challenges at BGA and CSP Assembly and Rework Stage(BGA、CSP组装和翻