各向同性铜粉导电胶的制备及性能研究

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1、武汉理工大学硕士学位论文各向同性铜粉导电胶的制备及性能研究姓名：黄丽娟申请学位级别：硕士专业：材料学指导教师：曾黎明20091101这样可以在较低的导电填料添加比例下获得导电性能和粘接强度均较好的导电胶。关键词：导电胶，环氧树脂，酚醛树脂，体积电阻率，剪切强度AbstractConductiveadhesiveisakindofadhesivewhichhasbothconductivityandbondingstrength．Withtherapiddevelopmentofelectronicindustryandinformationtechnology,theelect

2、ronicdevicesaredevelopingtowardsthedirectionofminiaturization，portabilityandhigh—integration．Conductiveadhesiveismoreandmorewidelyusedinmicroelectronicinterconnection．ComparingwiththetraditionalSn／Pbsolder,conductiveadhesivehasmanyadvantages，suchashighresolution，lowbondingtemperatureandsimpl

3、einterconnectionprocess，itisanidealsubstituteofSn／Pbsolder．SotheresearchofconductiveadhesiveisofgreatsignificanceInthispaper,heat—curablecopperfilledconductiveadhesivewassynthesizedusingphenolicmodifiedepoxyresinasthematrix，copperpowderasconductivefillerandotheragentsastheadditiveagents．Theo

4、ptimumfillingamountoftheadditiveagentsintheconductiveadhesivesystemwasattainedthroughorthogonalexperiment．TheresultshowedthatthemassofsilanecouplingagentKH一550andthereducingagentformaldehydewere3％and7％ofthemassofcopperpowderrespectively,whilethemassofthedefoamingagentwasO．1％ofthesystem’Stota

5、lwei-glat．KH．550couldimprovethedispersionprope!tyofcopperpowder,whiletheaddingofKH．550andformaldehydecouldalsoprotectcopperpowderfromoxidizing．Thecuringprocess，thermalstability,conductivityandshearingstrengthofcopperfilledconductiveadhesiveWeretested．ThecuringprocessofconductiveadhesiveWasst

6、udiedthroughinfraredspectrumanddifferentscalmingcaloric(DSC)anlysis．TheresultoftheinfraredspectrumanlysisshowedthatthephenolichydroxylgroupreactedwiththeepoxygroupandthecondensationreactionWasoccurredbetweenthemethylgroupsofphenolicresin．TheDSCanalysis，whichprovidesomereferencestotheconfirmi

7、ngoftheparametersofthecuringprocess，showedthattheapproximategeltemperatureofconductiveadhesivewas86。C，thecuringtemperatureWas152。Candthepost—treatingtemperaturewas171℃．CalculatedthroughKissingerandCraneequation，theapparentactivationenergyWas51．64KJ