EIAJ ED-7311-18 Standard of integrated circuit package (P-ILGA)

EIAJ ED-7311-18 Standard of integrated circuit package (P-ILGA)

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时间:2019-10-18

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1、EIAJED-7311-18EIAJED-7311-18EIAJED-7311-18StandardofJapanElectronicsandInformationTechnologyIndustriesAssociationStandardofintegratedcircuitspackage(P-ILGA)1.ScopeofApplicationThisstandardregulatedoutlinedrawingsanddimensionsofPlasticInterstitialLandGridArray(hereinafterref

2、erredtoasP-ILGA),especiallyplasticpackage,classifiedprimaryasformAandsecondaryas”terminal-N”undertheEIAJED-7300(Recommendedpracticeonstandardforthepreparationofoutlinedrawingsofsemiconductorpackages).2.TerminologyThedefinitionofthetermsusedinthistechnicalreportcomplieswitht

3、heEIAJED-7300andEIAJEDR-7329[DesignguidelineofintegratedcircuitsforPlasticInterstitialLandGridArraypackage(P-ILGA)].3.HistoryRecently,electronicappliancesbecomesmaller,conventionalleadedtypepackagessuchasSOPandQFPbecomeunsuitable,anddemandforno-leadtypepackagesmakessupplier

4、sdevelopandcommercializesuchtypeofpackages.Thesedesignguidelinewereinintendedtostandardizetheouterdimensionsor“terminal-N”packagesandensurecompatibilitybetweenproducts.Fortheintegrationofdefinitionsaboutdimensionsorpackages,whichhaveleadsonbothsidesandaroundfoursides,thepac

5、kageswereoverviewedwhenthedesignguidelinewasmade.EIAJEDR-7318[DesignguidelineofintegratedcircuitsforPlasticVerySmallOutlineNon-LeadedPackage(P-VSON)]wasestablishedinDecember,1998,whichhaveleadsonbothsides,andEIAJEDR-7324[DesignguidelineofintegratedcircuitsforPlasticVerythin

6、QuadFlatNon-leadedpackage(P-VQFN)]wasestablishedinApril,1999,whichhaveleadsaroundfoursides.EIAJEDR-7329placeswitchthederivationpackageofEIAJEDR-7324.Andthispackagehasterminals,whichnewly,zigzag(staggered)terminaltypewitchP-ILGA.ItbeganadiscussionfromJanuary,2001,andestablis

7、hmentscheduleinMarch,2002.Thisstandardshowsthestandarddesignvaluesontheconceptofthedesigncentersasfaraspossibleforstandardization.4.DefinitionofP-ILGAItisclassifiedintoNterminalsofsecondcategoryhavingtheformofD.It’sleadsareflatandpositionedatthebottomaroundfoursidesorthepac

8、kagetomakeitpossibletomountontheprintedcircuitboard(Metalexposingareaisnotdefinedi

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