重要无铅IPC规范.ppt

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1、重要无铅IPC规范8/14/20211其中三项有关吃锡J-STD-001D电气与电子组装件锡焊要求IPC-A-610D印制板组装件验收条件IPC-7095BGA的设计与组装过程的实施8/14/20212IPCClassificationClass1–GeneralElectronicProductsClass2–DedicatedServiceElectronicProductsClass3–HighPerformanceElectronicProducts8/14/20213IPC-A-610D2005Februaryversion8/14/2

2、0214GeneralCommentsVisualappearanceofPb-freesolderjointsShouldnotberejectedonthebasisofthisdullappearanceRoughsurfaceofPb-freesolderjointsisnotadefectToefilletsarenotarequirementforacceptanceofPb-freejoints8/14/20215Newitemin“D＂version1.4.10Pin-in-PasteSeeIntrusiveSolderPbFre

3、eChapter5frompage637.4UnsupportedHolesBGA8.2.12PlasticBGA….Acceptablelead-freeandtin-leadconnectionsmayexhibitsimilarappearancesbutleadfreealloysaremorelikelytohave:·Surfaceroughness(grainyordull)·Greaterwettingcontactangles8/14/20216Table1-2InspectionMagnification(LandWidth)

4、LandWidthsorLandDiameters1MagnificationPowerInspectionRangeMaximumReferee>1.0mm[0.0394in]1.5Xto3X4X4X≤3Xto7.5X10X10X≥≤7.5Xto10X20X20X<0.25mm[0.00984in]20X40X40XNote1:Aportionofaconductivepatternusedfortheconnectionand/orattachmentofcomponents.8/14/20217Solderconnectionwetting

5、angleThesolderconnectionwettingangle(soldertocomponentandsoldertoPCBterminationdonotexceed90°(Figure5-1A,B)Asanexception,thesolderconnectiontoaterminationmayexhibitawettingangleexceeding90°(Figure5-1C,D)whenitiscreatedbythesoldercontourextendingovertheedgeofthesolderabletermi

6、nationareaorsolderresist.8/14/20218SolderingAcceptabilityRequirementssoldertoPCBterminationdonotexceed90°soldertoPCBterminationdonotexceed90°8/14/202195.2.1SolderingAnomalies–ExposedBasisMetalAcceptable-Class1,2,3Exposedbasismetalon:VerticalconductoredgesCutendsofcomponentlea

7、dsorwiresOrganicSolderabilityPreservative(OSP)coatedlandsExposedsurfacefinishesthatarenotpartoftherequiredsolderfilletarea8/14/202110ExposedBasisMetal(cont.)Acceptable-Class1ProcessIndicator-Class2,3Exposedbasismetaloncomponentleads,conductorsorlandsurfacesfromnicksorscratche

8、sprovidedconditionsdonotexceedtherequirementsof7.1.2.3forleadsand10.