SMT新锡膏评估实例.ppt

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1、SolderPasteEvaluationSolderPasteEvaluationSolderPasteTestPlanPhaseItemOwnerDueDateStatusIPreparationSearchthe2ndsource30-MayFinishedGetallsolderpastesample30-MayFinishedGetallsolderpastedocument30-MayFinishedIIProcessVerificationPrintability8-JunFinishedViscositytest8-JunFinishedSlumptest8-Jun

2、FinishedThicknessCpkanalysis8-JunFinishedSolderabilityverification8-JunFinishedIIISolderreliabilityTestX-raytest20-JunFinishedCrosssectionverification20-JunFinishedPullandpushtest20-JunFinished2SolderPasteEvaluationSamples3SolderPasteEvaluationPrintabilityPrintParameters:TestPattern:>Stencil:0

3、.12mmthicknessspecial>Padpattern:Width3.0mm>Printer:MPM125Length20mm>Printspeed:45mm/secDistance0.5-2.0mm>Separationspeed:2.5m/secPrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentScore:5-perfect,4-good,3-basic,2-poor,1-unallowableSolderPasteEvaluationViscosity

4、Testparameters:>Equipment:MALCOMPCU205>Testtemperature:25℃>Revolution:10rpm>Mixtime:5minPrintabilityViscositySlumpThicknessSolderabilityX-rayCrosssectionPullandpushContentAlltheresultsareoutofspecexceptAIMNC259,buttheviscositycanbeadjustedbasedontheproductrequirement.SolderPasteEvaluationSlum

5、pPrintParameters:TestPattern:>Stencil:0.12mmthicknessspecial>Padpattern:Width3.0mm>Printer:MPM125Length20mm>Printspeed:45mm/secDistance0.5-2.0mmTestmethod:>Tocheckthesolderpasteshapeprintedonboardafterseveralminutesifexistslumporchipchange.PrintabilityViscositySlumpThicknessSolderabilityX-rayC

6、rosssectionPullandpushContentAllthesolderpastecankeeptheshapeafterseveralminuteswithoutslump.SolderPasteEvaluationThicknessTestmethod:>Equipment:2Dlaserthicknesstester>PCBNo:13610761X>Padpattern:terminal>Testquantity:5pointperPCB,continuous5pcspertype.PrintabilityViscositySlumpThicknessSoldera

7、bilityX-rayCrosssectionPullandpushContentRelativelyspeaking,EF305,EF105andNC259arenearlysameasNC254,TongFangandHuaQingareworseinthicknessstability.SolderPasteEvaluationSolderabilityTestmethod:>Equipment:2Dlaserthicknesstester>PCBNo:1361