电子元器件封装图示大全

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1、电子元器件封装图示大全LQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageQFPQuadFlatPackageTQFP100LRIMMRIMMForDirectRambusSBGASC-705LSDIPSIMM30SIMM30PinoutSIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSI

2、PSingleInlinePackageSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSODIMMSmallOutlineDualIn-lineMemoryModuleSOSmallOutlinePackageSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET

3、462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSOHSOJ32LSOJSOPEIAJTYPEII14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP16LSSOPSocket603FosterLAMINATETCSP20LChipScalePackageTO18

4、TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageLAMINATEUCSP32LChipScalePackageuBGAMicroBallGridArrayuBGAMicroBallGridArray VLBusVESALocalBusXTBus8bitZIPZig-ZagInlinePac

5、kageGullWingLeadsHSOP28ISAIndustryStandardArchitectureITO220ITO3pJ-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsJLCCLCCLDCCLGALLP8LaLQFPPCDIPPCI32bit5VPeripheralComponentInterconnectPCI64bit3.3VPeripheralComponentInterconn

6、ectPCMCIAPDIPPGAPlasticPinGridArrayPLCCPQFPPS/2PS/2mouseportpinoutPSDIPDIMM168DIMMDDRDIMM168DualIn-lineMemoryModuleDIMM168DIMM168PinoutDIMM184ForDDRSDRAMDualIn-lineMemoryModuleDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkEIAEIAJEDECformu

7、latedEIAStandardsEISAExtendedISA FBGAFDIPFTO220FlatPackAC'97AC'97v2.2specification详细规格AGP3.3VAcceleratedGraphicsPortSpecification2.0详细规格AGPPROAcceleratedGraphicsPortPROSpecification1.01详细规格AGPAcceleratedGraphicsPortSpecification2.0详细规格AMRAudio/ModemRise

8、rAX078AX14C-BendLeadCERQUADCeramicQuadFlatPackCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayCeramicCaseLAMINATECSP112LChipScalePackage窗体顶端 窗体底端BGABallGridArrayEBGA680LLBGA160LPBGA217LPlastic