电子元器件封装图示大全.pdf

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1、电子元器件封装图示大全BGABallGridArrayBQFP132EBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格SBGA192L详细规格TEPBGA288LTEPBGA288L详细规格TSBGA680L详细规格AC'97v2.2AC'97specification详细规格AGP3.3VAcceleratedGraphicsPortSpecification2.0详细规格AGPPROAcceleratedGraphicsPortPROSpecificat

2、ion1.01详细规格AGPAcceleratedGraphicsPortSpecification2.0详细规格AMRAudio/ModemRiserAX078AX14C-BendLeadCERQUADCeramicQuadFlatPackCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayCeramicCaseLAMINATECSP112LChipScalePackageDIMM168DIMMDDR

3、DIMM168DualIn-lineMemoryModuleDIMM168DIMM168PinoutDIMM184ForDDRSDRAMDualIn-lineMemoryModuleDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkEIAJEDECEIAformulatedEIAStandardsEISAExtendedISAFBGAFDIPFTO220FlatPackGullWingLeadsHSOP28ISAIndustryStandardAr

4、chitectureITO220ITO3pJ-STDJointIPC/JEDECJ-STDStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsJLCCLCCLDCCLGALLP8LaLQFPPCDIPPCI32bit5VPeripheralComponentInterconnectPCI64bit3.3VPeripheralComponentInterconnectPCMCIAPDIPPGAPlasticPinGridArrayPLCCPQFPPS/2mousep

5、ortPS/2pinoutPSDIPLQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageQFPQuadFlatPackageTQFP100LRIMMRIMMForDirectRambusSBGASC-705LSDIPSIMM30SIMM30PinoutSIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIPS

6、ingleInlinePackageSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSODIMMSmallOutlineDualIn-lineMemoryModuleSOSmallOutlinePackageSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETA

7、ForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSOHSOJ32LSOJSOPEIAJTYPEII14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP16LSSOPSocket603FosterLAMINATETCSP20LChipScalePackageTO18TO220TO247TO252TO263

8、/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageLAMINATEUCSP32LChipScalePackageuBGAMicroBallGridArrayu