Double Patterning process development at IMEC

Double Patterning process development at IMEC

ID:40602300

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页数:34页

时间:2019-08-04

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1、DoublePatterningprocessdevelopmentatIMECM.Maenhoudt,D.Vangoidsenhoven,T.Vandeweyer,R.Gronheid,J.Versluijs,A.MillerIntroduction•Objectivesofthiswork–budgetverificationfor32nmHPcriticallayers•2flavorsofdoublepatterning:doublelitho,doubleetch(LELE)andSelf-AlignedDP(SADP)–statusandfeasibil

2、ityofalternativeprocessestoreduceDPTCoO•32nmhalfpitchspecs(ITRS)SingleexposureDoublepatterning–CDU2.6nm1.3nm–Overlay6.4nm≅2.3nm–LWR1.7nm1.7nmM.MaenhoudtLithoForum2008©imec20082outline•Litho-Etch-Litho-Etch–doublelineprocessforActive/Poly•CDU•overlay–doubletrenchprocessforM1–alternative

3、processes(CoO)•Self-AlignedDoublePatterning–32nmHPprocess•CDU–alternativeprocess(CoO)•ConclusionsM.MaenhoudtLithoForum2008©imec20083Litho-Etch-Litho-Etch•2Dcompatibleprocesses•doubletrenchvsdoubleline–DTmostintuitiveforMetallayers–DLmostintuitiveforActive,Polylayersdoubletrenchapproach

4、doublelineapproachSpacesonreticleLinesonreticlePositiveresistPositiveresistPrinttrenchesandetchHMPrintlinesandetchHMStripresistand2ndphotoStripresistand2ndphotoEtchHMandstripresistEtchFinaletchandremoveHMStripresistandremoveHMM.MaenhoudtLithoForum2008©imec20084outline•LELE–doublelinepr

5、ocessforActive/Poly•CDU•overlay–doubletrenchprocessforM1–alternativeprocesses(CoO)•SADP–32nmHPprocess•CDU–alternativeprocess(CoO)•ConclusionsM.MaenhoudtLithoForum2008©imec20085LELEdoublelineprocessLitho1Etch1HMLitho2Etch2HMremoval•32nmHPpoly:singleoxideHM(30nm)process•22nmHPpoly:double

6、HMneeded32nmdenselines22nmdenselinesSTEMimagingandsamplepreparationatASMLM.MaenhoudtLithoForum2008©imec20086CDU32nmLELE(rawexperimentaldata)NA=1.35ann.ill.0.8/0.5CD’safterfinaletchk1f=0.22Matchingofpopulationsiscritical.Etchfingerprintisdominating(notoptimised).Line1:Line2:Space1Space2

7、Mean=36.1Mean=38.8Mean=26.8Mean=26.253σ=4.6nm3σ=5.5nm3σ=5.7nm3σ=5.6nm(CDSEM,2579measurements)L1L2S1S2M.MaenhoudtLithoForum2008©imec20087CDU32nmLELEapplyingDosemapper™NA=1.35CD’safterfinaletchann.ill.0.8/0.5k1f=0.22DosemappercorrectionshavepotentialtoreduceCDU.Processcontrolandstabili

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