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ID:44445732
大小:482.00 KB
页数:29页
时间:2019-10-22
《常见原件封装方式》由会员上传分享,免费在线阅读,更多相关内容在行业资料-天天文库。
1、常見原件封裝方式2006/04/061BGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPF
2、TO-220FlatPackHSOP-28JLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCCLQFP100LMETALQUAD100LQFPQuadFlatPackageSOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackageTO252TO263/TO268QFPQuadFlatPackageTQFP100
3、LSC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackageSOJ32LSOJSOPEIAJTYPEII14LSSOP16LTO247SSOPTO3TO5TO52TO8TO92TSOPThinSmallOutlinePackagTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig-ZagInlinePackageBQFP132C-Be
4、ndLeadCERQUADCeramicQuadFlatPackGullWingLeadsCeramicCaseLAMINATECSP112LChipScalePackagePDIPSNAPTKSNAPZPSOH再见
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