杜邦产品介绍(PPT41).ppt

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1、IntroductiontoFlexibleCircuitMaterialsPresentedby:JonathanC.LimPartII:(~40minutes)簡報大綱軟性電路板基材之介紹基材的主要CompositionDielectricSubstrates(絕緣體)Adhesive(膠質)Conductor(導體)m簡報大綱(continue)杜邦產品壓克力膠系列(ModifiedWAAcrylic)之基材環亞樹脂膠系列(ModifiedEpoxy)之基材杜邦料號解說Pyralux®Telcam®

2、m軟性電路板之主要基材CopperCladLaminates(銅箔基材)Single-SidedC.C.L.(單面銅箔基材)AdhesiveConductorDielectricSubstratemDouble-SidedC.C.L..(雙面銅箔基材)ConductorDielectricSubstrateAdhesive軟性電路板之主要基材mAdhesive-LessC.C.L..(無膠銅箔基材)DielectricSubstrateConductor軟性電路板之主要基材mCoverlay(覆蓋膜)軟性電

3、路板之主要基材mDielectricSubstrateAdhesive離型紙AdhesiveKaptonStiffner(補強材)軟性電路板之主要基材DielectricSubstrateAdhesivemBondplyDielectricSubstrateAdhesiveAdhesive軟性電路板之主要基材mMylarAdhesiveKaptonAdhesiveSheetAdhesivePhotoImageableCoverlay(PIC)DryFilmFine-LineApplicationCamera

4、AutomotiveOthers軟性電路板之主要基材mDielectricSubstratesDefinitionAbasefilmonwhichtheprintedconductorsarelaid.Afilmwhichprovideselectricalinsulationbetweenconductors.Afilmwhichprovidesmechanicalstrengthofthecircuit.m必備之特性MechanicalStrengthFlexibilityDimensionalStab

5、ilityDielectricPropertiesThermalPropertiesChemicalResistanceMoistureAbsorptionCostDielectricSubstratesmSubstrates之種類PolyimidePolyesterFluorocarbonAramidPaperCompositeDielectricSubstratesmPolyimide:PopularizedbyDuPontunder“Kapton”AlsoknownasPIFirstchoiceoff

6、ilminmostFPCInfusibleandflameretardantHighTg(約260C-280C)GooddimensionalstabilitySubstratesmSubstratesPolyester:PopularizedbyDuPontunder“Mylar”AlsoknownasPETLowestcostdielectricmaterialMostlyusedinlow-costconsumerapplicationGoodmechanicalpropertiesBadtherma

7、lpropertiesmSubstratesAramidPaper:SoldunderDuPonttradename“Nomex”UsedinspecializedapplicationGoodthermalinsulationmaterialmPropertyPolyesterPolyimideFluorocarbonAramidPaperCompositeTensileStrengthExcellentExcellentFairGoodBestFlexibilityExcellentExcellentE

8、xcellentGoodFair/GoodDim.StabilityFair/GoodGoodFairGoodFair/GoodDielectricStr.GoodGoodVeryGoodVeryGoodGoodSolderibilityPoorExcellentFairExcellentExcellentC.O.T.(C)105200-230150-180220105-180ThermalExp.LowLowH