SEMI G28-0997 SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED

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1、SEMIG28-0997N/A©SEMI1986,1997SPECIFICATIONFORLEADFRAMESFORPLASTICMOLDEDS.O.PACKAGES1Purpose4.4coinedareaÑThatareaatthetipofthebondÞn-gersßattenedtoproduceanacceptablesurfaceforwireThisspeciÞcationdeÞnestheacceptancecriteriaforbonding(seeFigure3).stampedleadfr

2、amesforplasticmoldedS.O.packages.4.5crossbowÑTransversebowingoftheleadframe2Scope(seeFigure4).ThisspeciÞcationisaguidelineforproductionof4.6functionalareaÑThedieattachpadandthewirestampedS.O.Leadframestobeusedinplasticmoldedbond(leadtips)area.S.O.packages.4.7

3、leadtwistÑAngularrotationofbondingÞngers(seeFigure5).3ReferencedDocuments3.1SEMISpeciÞcations4.8pitÑAshallowsurfacedepressionorcraterintheleadframematerial.SEMIG4ÑSpecificationforIntegratedCircuitLead-frameMaterialsusedintheProductionofStamped4.9slugmarksÑRan

4、domdentsintheleadframeLeadframescausedbyforeignmaterialinthestampingdie.SEMIG9ÑSpecificationforStampedLeadframesfor4.10stampedleadframeterminologyÑ(SeeFigurePlasticMoldedDual-In-LineSemiconductorPackages6.)SEMIG10ÑStandardMethodforMechanicalMea-5OrderingInfor

5、mationsurementforPlasticPackageLeadframesPurchaseordersforleadframesforplasticmoldedS.O.SEMIG21ÑSpecificationforPlatingIntegratedCir-packagesfurnishedtothisspeciÞcationshallincludecuitLeadframesthefollowingitems:3.2ANSI/ASQCSpeciÞcations1a.Currentleadframespe

6、ciÞcationdrawing.ANSI/ASQCZ1.4ÑSamplingProceduresandTablesb.AlldimensionsandtolerancesperANSIY14.5forInspectionbyAttributespractices.3.3ANSISpeciÞcations2c.Materialtypeandphysicalcharacteristics(seeSEMIG4).ANSIY14.5MÑDimensioningandTolerancingd.Typehardnessan

7、dthicknessofanyrequiredplat-4Terminologying(seeSEMIG21).4.1burrÑAfragmentofexcessmaterialeitherhori-zontalorverticaladheringtothecomponentsurface.6DimensionsSeeTable1andFigure7forstandarddimensions.Tol-4.2camberÑCurvatureoftheleadframestripedgeinerancesshallb

8、eagreedbetweenvendorandcustomer.thehorizontalplane(seeFigure1).4.3coilsetÑLongitudinalbowingoftheleadframe7DefectLimitsandParameters(seeFigure2).(seeSEMIG10formeasurementmethods)7.1Intern